参数资料
型号: S71WS512NC0BFWAJ0
厂商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: 堆叠式多芯片产品(MCP)
文件页数: 7/13页
文件大小: 186K
代理商: S71WS512NC0BFWAJ0
July 19, 2006 S71WS-N_00_A6
S71WS-N
5
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
4.
MCP Block Diagram
Notes:
1. R-CRE is only present in CellularRAM-compatible pSRAM.
2. For 1 Flash + pSRAM, F1-CE# = CE#. For 2 Flash + pSRAM, CE# = F1-CE# and F2-CE# is the chip-enable pin for the second Flash.
3. Only needed for S71WS512N.
4. For the 128M pSRAM devices, there are 23 shared addresses.
5.
Connection Diagrams/Physical Dimensions
This section contains the I/O designations and package specifications for the S71WS-N.
5.1
Special Handling Instructions for FBGA Packages
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
VID
VCC
DQ15 to DQ0
RDY
pSRAM
Flash 1
(
Note 4
)
DQ15 to DQ0
Flash-only Address
Shared Address
F1-CE#
(
Note 2
)
ACC
R-UB#
R-LB#
R-CE2
R-CRE
(
Note 1
)
R-VCC
V
CC
V
CCQ
F-VCC
22
CLK
WP#
CLK
OE#
WE#
F-RST#
AVD#
CE#
OE#
WE#
RESET#
AVD#
ACC
WP#
RDY
V
SS
VSSQ
16
I/O15 to I/O0
16
R-CE1#
CE#
WE#
OE#
UB#
LB#
22
F2-CE#
(
Note 2
)
CLK
AVD#
CRE#
Flash 2
WAIT#
相关PDF资料
PDF描述
S71WS512NC0BFWAJ2 Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAJ3 Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAK0 Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAK2 Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAK3 Stacked Multi-Chip Product (MCP)
相关代理商/技术参数
参数描述
S71WS512NC0BFWAJ2 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAJ3 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAK0 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAK2 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BFWAK3 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)