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参数资料
| 型号： | S71WS512ND0BAWAK0 |
| 厂商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆叠式多芯片产品（MCP） |
| 文件页数： | 5/13页 |
| 文件大小： | 186K |
| 代理商： | S71WS512ND0BAWAK0 |
July 19, 2006 S71WS-N_00_A6
S71WS-N
3
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
2.
Ordering Information
The order number is formed by a valid combinations of the following:
2.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Package Marking Note:
The package marking omits the leading
S
from the ordering part number.
S71WS
256
N
C
0
BA
W
A
K
0
Packing Type
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
RAM Supplier, DYB Power Up, Speed Combinations
K = 2 = CellularRAM 2, 0, 54 MHz
P = 2 = CellularRAM 2, 1, 54 MHz
J
= 2 = CellularRAM 2, 0, 66 MHz
N = 2 = CellularRAM 2, 1, 66 MHz
H = 2 = CellularRAM 2, 0, 80 MHz
M = 2 = CellularRAM 2, 1, 80 MHz
Package Modifier
A = 8x11.6x1.2 mm, 84-ball FBGA
T
= 8x11.6x1.4 mm, 84-ball FBGA
E = 9x12x1.4 mm, 84-ball FBGA
Y = 9x12x1.2 mm, 84-ball FBGA
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin FIne-Pitch BGA, Lead (Pb)-free Compliant Package
BF = Very Thin FIne-Pitch BGA, Lead (Pb)-free Package
Chip Contents—2
No content
pSRAM Density
B = 32 Mb
C = 64 Mb
D = 128 Mb
Process Technology
N = 110-nm MirrorBit Technology
Code Flash Density
512= 512 Mb (2x256Mb)
256= 256 Mb
128= 128 Mb
Product Family
S71WS = Multi-Chip Product, 1.8 Volt-only Simultaneous Read/Write Burst
Mode Flash Memory + pSRAM
Table 2.1
MCP Configurations and Valid Combinations
Valid Combinations
S71WS128N
B
0
BAW, BFW
A
K, P, J, N, H, M
C
A
K, P, J, N, H, M
S71WS256N
C
A
K, P, J, N, H, M
D
Y
K, P, J, N, H, M
S71WS512N
C
A
K, P, H, M
T
J, N, H, M
D
E
K, P, J, N, H, M
相关PDF资料 |
PDF描述 |
|---|---|
| S71WS512ND0BAWAK2 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAK3 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAN0 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAN2 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAN3 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71WS512ND0BAWAK2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAK3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAN0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAN2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BAWAN3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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