型号: | S71WS512ND0BFWE23 |
厂商: | SPANSION LLC |
元件分类: | 存储器 |
英文描述: | Stacked Multi-Chip Product (MCP) |
中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA84 |
封装: | 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 |
文件页数: | 18/188页 |
文件大小: | 2252K |
代理商: | S71WS512ND0BFWE23 |
相关PDF资料 |
PDF描述 |
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S71WS512ND0BFWE30 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE32 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE33 | Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE60 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BAWA20 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
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S71WS512ND0BFWE30 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE32 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE33 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE60 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71WS512ND0BFWE62 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |