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参数资料
| 型号： | S72NS128PD0AJFLG0 |
| 厂商： | Spansion Inc. |
| 英文描述： | MirrorBit Flash Memory and DRAM |
| 中文描述： | MirrorBit闪存和DRAM |
| 文件页数： | 13/14页 |
| 文件大小： | 335K |
| 代理商： | S72NS128PD0AJFLG0 |
S72NS-P_00_01 September 6, 2006
S72NS-P Based MCPs/PoPs
11
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
6.4
ASF128—128-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 12.0 mm
3581\16-039.24\8.3.6
PACKAGE
ASF128
JEDEC
N/A
D x E
12.00 mm x 12.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.95
1.05
1.15
PROFILE
A1
0.35
0.40
0.45
BALL HEIGHT
A2
0.59
---
0.72
BODY THICKNESS
D
12.00 BSC.
BODY SIZE
E
12.00 BSC.
BODY SIZE
D1
11.05 BSC.
MATRIX FOOTPRINT
E1
11.05 BSC.
MATRIX FOOTPRINT
MD
18
MATRIX SIZE D DIRECTION
ME
18
MATRIX SIZE E DIRECTION
n
128
BALL COUNT
N
128
MAXIMUM NUMBER OF BALLS
R
2
NUMBER OF LAND PERIMETERS
b
0.40
0.45
0.50
BALL DIAMETER
eE
0.65 BSC.
BALL PITCH
eD
0.65 BSC
BALL PITCH
SE / SD
0.325 BSC.
SOLDER BALL PLACEMENT
C3-C16,D3-D16,E3-E16,
F3-F16,G3-G16,H3-H16,
J3-J16,K3-K16,L3-L16,
M3-M16,N3-N16,P3-P16,
R3-R16,T3-T16
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
N IS THE MAXIMUM NUMBER OF BALLS ON THE FBGA PACKAGE.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
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相关代理商/技术参数 |
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| S72NS128PD0AJFLG2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Memory and DRAM |
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