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参数资料
| 型号： | S72NS128PD0KJGGC0 |
| 厂商： | Spansion Inc. |
| 英文描述： | MirrorBit Flash Memory and DRAM |
| 中文描述： | MirrorBit闪存和DRAM |
| 文件页数： | 12/14页 |
| 文件大小： | 335K |
| 代理商： | S72NS128PD0KJGGC0 |
10
S72NS-P Based MCPs/PoPs
S72NS-P_00_01 September 6, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
6.3
ALJ128—128-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 12.0 mm
3561 16 038 24 \ 5 15 6
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
N IS THE MAXIMUM NUMBER OF BALLS ON THE FBGA PACKAGE.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
PACKAGE
ALJ 128
JEDEC
N/A
D x E
12.00 mm x 12.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.15
PROFILE
A1
0.35
---
---
BALL HEIGHT
A2
0.60
---
0.72
BODY THICKNESS
D
12.00 BSC.
BODY SIZE
E
12.00 BSC.
BODY SIZE
D1
11.05 BSC.
MATRIX FOOTPRINT
E1
11.05 BSC.
MATRIX FOOTPRINT
MD
18
MATRIX SIZE D DIRECTION
ME
18
MATRIX SIZE E DIRECTION
n
128
BALL COUNT
N
128
MAXIMUM NUMBER OF BALLS
R
2
NUMBER OF LAND PERIMETERS
b
0.40
0.45
0.50
BALL DIAMETER
eE
0.65 BSC.
BALL PITCH
eD
0.65 BSC
BALL PITCH
SE / SD
0.325 BSC.
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
R3~R16, T3~T16
C3~C16, D3~D16, E3~E16, F3~F16
G3~G16, H3~H16, J3~J16, K3~K16
C
6
b
SIDE VIEW
0.10
C
128X
A1
0.15 M C A B
0.08 M C
7
SE
E1
D1
7
18 17
13 12
14
15
16
10
7
8
9
11
6
5
2
3
4
eE
SD
eD
A
PIN A1
CORNER
D
E
B
C
H
J
F
G
M
N
L
K
T
U
R
P
BOTTOM VIEW
1
V
C
A
D
E
INDEX MARK
9
CORNER
PIN A1
C
B
0.10
0.10
(2X)
TOP VIEW
C
0.10
(2X)
A2
A
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| S72NS128PD0KJGGG0 | MirrorBit Flash Memory and DRAM |
| S72NS128PD0KJGGG2 | MirrorBit Flash Memory and DRAM |
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相关代理商/技术参数 |
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| S72NS128PD0KJGGC2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Memory and DRAM |
| S72NS128PD0KJGGC3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Memory and DRAM |
| S72NS128PD0KJGGG0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Memory and DRAM |
| S72NS128PD0KJGGG2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Memory and DRAM |
| S72NS128PD0KJGGG3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Memory and DRAM |
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