参数资料
型号: S72NS512PE0AJGLC3
厂商: SPANSION LLC
元件分类: 存储器
英文描述: MirrorBit Flash Memory and DRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA133
封装: 11 X 10 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
文件页数: 3/14页
文件大小: 771K
代理商: S72NS512PE0AJGLC3
September 24, 2008 S72NS-P_00_07
S72NS-P MCP/PoP Memory System Solutions
11
Da ta
Sh e e t
(Adv a n ce
In f o r m ation)
6.2
NSC133—133-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 8.0 mm
PACKAGE
NSC 133
JEDEC
N/A
D x E
8.00 mm x 8.00 mm
NOTE
PACKAGE
SYMBOL
MIN
NOM
MAX
A
0.90
1.00
1.10
PROFILE
A1
0.20
0.25
0.30
BALL HEIGHT
A2
0.70
0.76
0.82
BODY THICKNESS
D
8.00 BSC
BODY SIZE
E
8.00 BSC
BODY SIZE
D1
6.50 BSC.
MATRIX FOOTPRINT
E1
6.50 BSC.
MATRIX FOOTPRINT
MD
14
MATRIX SIZE D DIRECTION
ME
14
MATRIX SIZE E DIRECTION
n
133
BALL COUNT
b
0.25
0.30
0.35
BALL DIAMETER
eE
0.50 BSC.
BALL PITCH
eD
0.50 BSC
BALL PITCH
SD / SE
0.25 BSC.
SOLDER BALL PLACEMENT
D5-D11,E4-E11,F4-F11,G4-G11 DEPOPULATED SOLDER BALLS
H4-H11,J4-J11,K4-K11,L4-L11
3583 \ 16-039.22 \ 8.15.06
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1
SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
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