参数资料
型号: S80C196MC
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 16-BIT, 16 MHz, MICROCONTROLLER, PQFP80
封装: EIAJ, SHRINK, QFP-80
文件页数: 16/22页
文件大小: 1454K
代理商: S80C196MC
8XC196MC
PROCESS INFORMATION
This device is manufactured on PX29.5, a CHMOS
III-E process. Additional process and reliability infor-
mation is available in the
Intel Quality
System Handbook.
270946–16
NOTE:
1. EPROMs are available as One Time Programmable
(OTPROM) only.
Figure 3. The 8XC196MC Family Nomenclature
Thermal Characteristics
Package
θja
θjc
Type
PLCC
35
°C/W
13
°C/W
QFP
56
°C/W
12
°C/W
SDIP
TBD
All thermal impedance data is approximate for static air
conditions at 1W of power dissipation. Values will change
depending on operation conditions and application. See
the Intel
Packaging Handbook (order number 240800) for a
description of Intel’s thermal impedance test methodology.
8XC196MC Memory Map
Description
Address
External Memory or I/O
0FFFFH
06000H
Internal ROM/EPROM or External
5FFFH
Memory (Determined by EA)
2080H
Reserved. Must contain FFH.
207FH
(Note 5)
205EH
PTS Vectors
205DH
2040H
Upper Interrupt Vectors
203FH
2030H
ROM/EPROM Security Key
202FH
2020H
Reserved. Must contain FFH.
201FH
(Note 5)
201CH
Reserved. Must Contain 20H
201BH
(Note 5)
CCB1
201AH
Reserved. Must Contain 20H
2019H
(Note 5)
CCB0
2018H
Reserved. Must contain FFH.
2017H
(Note 5)
2014H
Lower Interrupt Vectors
2013H
2000H
SFR’s
1FFFH
1F00H
External Memory
1EFFH
0200H
488 Bytes Register RAM (Note 1)
01FFH
0018H
CPU SFR’s (Notes 1, 3)
0017H
0000H
NOTES:
1. Code executed in locations 0000H to 03FFH will be
forced external.
2. Reserved memory locations must contain 0FFH unless
noted.
3. Reserved SFR bit locations must contain 0.
4. Refer to 8XC196KC for SFR descriptions.
5.
WARNING: Reserved memory locations must not be
written or read. The contents and/or function of these lo-
cations may change with future revisions of the device.
Therefore, a program that relies on one or more of these
locations may not function properly.
3
x
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