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| 型号： | SA56004AD,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 35/43页 |
| 文件大小： | 516K |
| 描述： | IC TEMP SENSOR DIGITAL 8SOIC |
| 标准包装： | 2,500 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部和外部 |
| 感应温度： | -40°C ~ 125°C |
| 精确度： | ±3°C（最小值） |
| 拓扑： | ADC（三角积分型），多路复用器，寄存器库 |
| 输出类型： | I²C?/SMBus? |
| 输出警报： | 是 |
| 输出风扇： | 是 |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
| 其它名称： | 935274525118 SA56004AD-T SA56004AD-T-ND |
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SA56004X
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7 25 February 2013
35 of 43
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 Surface mount reflow
soldering description .
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
" Through-hole components
" Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
" Board specifications, including the board finish, solder masks and vias
" Package footprints, including solder thieves and orientation
" The moisture sensitivity level of the packages
" Package placement
" Inspection and repair
" Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
" Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
" Solder bath specifications, including temperature and impurities
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SA56004ADP | 制造商:NXPSEM 功能描述: |
| SA56004ADP,118 | 功能描述:板上安装温度传感器 TEMP SENSOR RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| SA56004AD-T | 功能描述:板上安装温度传感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| SA56004ATK | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:±1 °C accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with overtemperature alarms |
| SA56004ATK,118 | 功能描述:板上安装温度传感器 SMBUS-COMPATIBLE REM LOCL DIGI TEMP SENS RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
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