参数资料
型号: SA571NG
厂商: ON Semiconductor
文件页数: 2/11页
文件大小: 0K
描述: IC COMPANDOR DUAL GAIN 16-DIP
标准包装: 25
类型: 压缩扩展器
应用: 蜂窝式无线电,播放器
安装类型: 通孔
封装/外壳: 16-DIP(0.300",7.62mm)
供应商设备封装: 16-DIP
包装: 管件
产品目录页面: 1131 (CN2011-ZH PDF)
其它名称: SA571NG-ND
SA571NGOS
SA571
http://onsemi.com
10
PACKAGE DIMENSIONS5
SOIC16 WB
D SUFFIX
CASE 751G03
ISSUE C
D
14X
B
16X
SEATING
PLANE
S
A
M
0.25
B S
T
16
9
8
1
h
X
45
_
M
B
M
0.25
H
8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
MIN
MAX
MILLIMETERS
A
2.35
2.65
A1
0.10
0.25
B
0.35
0.49
C
0.23
0.32
D
10.15
10.45
E
7.40
7.60
e
1.27 BSC
H
10.05
10.55
h
0.25
0.75
L
0.50
0.90
q
0
7
_
PDIP16
N SUFFIX
CASE 64808
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
9
16
K
PLANE
T
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
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