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参数资料
型号： SAK-XC2236N-40F40L
厂商： INFINEON TECHNOLOGIES AG
元件分类： 微控制器/微处理器
英文描述： 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PQFP64
封装： 0.50 MM PITCH, GREEN, PLASTIC, LQFP-64
文件页数： 10/110页
文件大小： 1601K
代理商： SAK-XC2236N-40F40L
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Package and Reliability
Data Sheet
107
V1.3, 2010-04
5
Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC223xN in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC223xN is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 38
Package Parameters (PG-LQFP-64-6)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension
Ex
× Ey –
5.6
× 5.6
mm
–
Power Dissipation
P
DISS
–0.8
W
–
Thermal resistance
Junction-Ambient
RΘJA
–
40
K/W No thermal via
1)
1) Device mounted on a 4-layer board without thermal vias; exposed pad not soldered.
37
K/W 4-layer, no pad
2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
25
K/W 4-layer, pad
3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
相关PDF资料
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相关代理商/技术参数
参数描述
SAK-XC2236N-40F80L 功能描述:16位微控制器 - MCU 16 BIT FLASH C11 BCS RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
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SAK-XC2237M-104F40L 功能描述:IC MCU 16BIT 320KB FLASH 64LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:XC22xxM 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:260 系列:73S12xx 核心处理器:80515 芯体尺寸:8-位 速度:24MHz 连通性:I²C，智能卡，UART/USART，USB 外围设备:LED，POR，WDT 输入/输出数:9 程序存储器容量:64KB（64K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:2K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-VFQFN 裸露焊盘 包装:管件
SAK-XC2238N-24F40L AA 功能描述:IC MCU 16/32B 192KB FLASH 64LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:XC22xxN 标准包装:330 系列:- 核心处理器:- 芯体尺寸:8/16-位 速度:40MHz 连通性:UART/USART 外围设备:DMA，PWM，WDT 输入/输出数:32 程序存储器容量:- 程序存储器类型:外部程序存储器 EEPROM 大小:- RAM 容量:- 电压 - 电源 (Vcc/Vdd):4.5 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:100-BQFP 包装:管件
SAK-XC2238N-24F40LAA 制造商:Rochester Electronics LLC 功能描述: 制造商:Infineon Technologies AG 功能描述:
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