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参数资料
| 型号： | SB502 |
| 元件分类： | 参考电压二极管 |
| 英文描述： | 5 A, 200 V, SILICON, BRIDGE RECTIFIER DIODE |
| 封装： | PLASTIC, SB5, 4 PIN |
| 文件页数： | 1/2页 |
| 文件大小： | 61K |
| 代理商： | SB502 |
MECHANICAL DATA
FEATURES
Data Sheet No. BRSB-500-1C
MECHANICAL SPECIFICATION
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated pins
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any
Weight: 0.38 Ounces (10.6 Grams)
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
MAXIMUM RATINGS& ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
Average Forward Rectified Current@ T = 55 C
A
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
IO
VRMS
VRRM
VRM
SYMBOL
RATINGS
UNITS
VOLTS
SB
50
100
200
400
1000
35
70
140
280
700
5
Peak Forward Surge Current.
T = 150 C
J
O
Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method).
Maximum Forward Voltage (Per Diode) at5 Amps DC
VOLTS
AMPS
VFM
IFSM
200
1.0 (Typical< 0.95)
Typical Thermal Resistance
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
IRM
R
θJA
R
θJL
°C/W
mA
A
@ T = 25 C
A
o
@ T = 100 C
A
o
5
0.5
17
3.3
E21
Junction Operating Temperature Range
T T
J,
STG
°C
-55 to +150
3.01 05sb
(1) Unit mounted on 3.0" sq.x 0.11" (7.5cm sq.x 0.3cm) aluminum plate
NOTES:
600
800
50
100
200
400
1000
600
800
420
560
500
501
502
504
506
508
510
C1
B2
B1
D1
C
B
A1
L
D
A
AC
+
_
C
D1
C1
0.400
10.2
2.06
0.070
D
1.27
0.05
39.9
4.8
1.570
0.188
L
1.0*
25.4*
6.4
0.250
7.6
0.300
A
A1
B
B1
B2
* This measurement isa "Minimum"
21.7
0.855
0.820
21.0
SYM
TYP
MAX
INCHES
SB5 PACKAGE SHOWN ACTUAL SIZE
SERIES SB500- SB510
SB506
712
+
_
Junction to Ambient (Note 1)
Junction to Lead (Note 1)
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 200 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
RELIABLE LOW-COST MOLDED PLASTIC CONSTRUCTION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical< 2%, Max.< 10% of Die Area)
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