参数资料
型号: SBR2U30P1-7
厂商: Diodes Inc
文件页数: 2/5页
文件大小: 122K
描述: RECTIFIER SBR 2A 30V POWERDI123
产品培训模块: Super Barrier Rectifier (SBR®)
其它图纸: DFL(R,U,S,), SBR(2,3) Series Side
DFL(R,U,S,), SBR(2,3) Series Top
DFL(R,U,S,), SBR(2,3) Series Bottom
标准包装: 1
系列: SBR®
二极管类型: 超级势垒
电压 - (Vr)(最大): 30V
电流 - 平均整流 (Io): 2A
电压 - 在 If 时为正向 (Vf)(最大): 400mV @ 2A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 400µA @ 30V
安装类型: 表面贴装
封装/外壳: 2-SMD,扁平引线
供应商设备封装: PowerDI? 123
包装: 标准包装
产品目录页面: 1593 (CN2011-ZH PDF)
其它名称: SBR2U30P1DIDKR
SBR2U30P1
Document number: DS30706 Rev. 7 - 2
2 of 5
www.diodes.com
March 2012
? Diodes Incorporated
SBR2U30P1
SBR and POWERDI are registered trademarks of Diodes Incorporated.
Maximum Ratings
@TA
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VRM
30 V
RMS Reverse Voltage
VR(RMS)
21 V
Average Rectified Output Current (See Figure 1)
IO
2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
IFSM
75 A
Non-Repetitive Avalanche Energy
(TJ
= 25°C, I
AS
= 5A, L = 8.5 mH)
EAS
105 mJ
Repetitive Peak Avalanche Energy
(TP
= 1μs, T
J
= 25°C)
PARM
1100 W
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Thermal Resistance Junction to Ambient (Note 5)
RθJS
RθJA
RθJA
5
178
123
oC/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150 oC
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 6)
V(BR)R
30 - - V IR
= 400μA
Forward Voltage Drop
VF
- 0.22 0.26
- 0.36 0.40
- 0.12 0.15 V
IF
= 0.1A, T
J
= 25oC
- 0.31 0.35
IF
= 1.0A, T
J
= 25oC
IF
= 2.0A, T
J
= 25oC
IF
= 0.1A, T
J
= 125oC
- 0.27 0.30
IF
= 1.0A, T
J
= 125oC
- 0.30 0.33
IF
= 2.0A, T
J
= 125oC
Leakage Current (Note 6)
IR
- 75 150 μA VR
= 5V, T
J
= 25oC
- 150 400 μA VR
= 30V, T
J
= 25oC
- 6 15 mA VR
= 5V, T
J
= 125oC
- 12 20 mA VR
= 30V, T
J
= 125oC
Notes: 3. Theoretical RθJS
calculated from the top center of the die straig
ht down to the PCB cathode tab solder junction.
4. FR-4 PCB, 2 oz. Copper, minimum recommended pad
layout per http://www.diodes.com/datasheets/ap02001.pdf.
5. Polymide PCB, 2 oz. Copper, minimum reco
mmended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
6. Short duration pulse test used to minimize self-heating effect.
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