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| 型号： | SC16C2550IB48,151 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 37/46页 |
| 文件大小： | 0K |
| 描述： | IC UART DUAL W/FIFO 48-LQFP |
| 标准包装： | 250 |
| 特点： | 2 通道 |
| 通道数： | 2，DUART |
| FIFO's： | 16 字节 |
| 电源电压： | 2.5V，3.3V，5V |
| 带自动流量控制功能： | 是 |
| 带IrDA 编码器/解码器： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 带CMOS： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-LQFP（7x7） |
| 包装： | 托盘 |
| 其它名称： | 568-3261 935270020151 SC16C2550IB48-S |
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Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
encoder/decoder
Product data
Rev. 03 — 19 June 2003
42 of 46
9397 750 11621
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12. Soldering
12.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for ne pitch SMDs. In these situations reow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
12.2 Through-hole mount packages
12.2.1
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
12.2.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
12.3 Surface mount packages
12.3.1
Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°C (SnPb process) or below 245 °C (Pb-free process)
– for all the BGA and SSOP-T packages
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| SC16C554DBIA68,529 | IC UART QUAD W/FIFO 68-PLCC |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C2550IN40 | 制造商:PHILIP 功能描述: |
| SC16C2550IN40,112 | 功能描述:IC UART DUAL W/FIFO 40-DIP RoHS:是 类别:集成电路 (IC) >> 接口 - UART（通用异步接收器/发送器） 系列:- 标准包装:250 系列:- 特点:* 通道数:2，DUART FIFO's:16 字节 规程:RS232，RS485 电源电压:2.25 V ~ 5.5 V 带并行端口:- 带自动流量控制功能:是 带IrDA 编码器/解码器:是 带故障启动位检测功能:是 带调制解调器控制功能:是 带CMOS:是 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:托盘 其它名称:XR16L2551IM-F-ND |
| SC16C2552 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual UART with 16-byte transmit and receive FIFOs |
| SC16C2552B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs |
| SC16C2552BIA44 | 功能描述:UART 接口集成电路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
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