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| 型号： | SC16IS752IBS,157 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 50/60页 |
| 文件大小： | 0K |
| 描述： | IC DUAL UART 64BYTE 32HVQFN |
| 标准包装： | 2,450 |
| 特点： | 低电流 |
| 通道数： | 2，DUART |
| FIFO's： | 64 字节 |
| 规程： | RS232，RS485 |
| 电源电压： | 2.5V, 3.3V |
| 带自动流量控制功能： | 是 |
| 带IrDA 编码器/解码器： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-HVQFN（5x5） |
| 包装： | 托盘 |
| 配用： | 568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART 568-3510-ND - DEMO BOARD SPI/I2C TO UART |
| 其它名称： | 935279288157 SC16IS752IBS SC16IS752IBS-ND |
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SC16IS752_SC16IS762
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 9 — 22 March 2012
54 of 60
NXP Semiconductors
SC16IS752; SC16IS762
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16IS752IBS-F | 功能描述:UART 接口集成电路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16IS752IPW | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support |
| SC16IS752IPW,112 | 功能描述:UART 接口集成电路 UART DUAL 12C/SPI RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16IS752IPW,128 | 功能描述:UART 接口集成电路 I2C/SPI-UARTBRIDGE RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16IS752IPW112 | 制造商:NXP Semiconductors 功能描述:IC DUAL UART FIFO 5MBPS 3.6V TSSOP28 |
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