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参数资料
| 型号： | SC185QULTRT |
| 厂商： | Semtech |
| 文件页数： | 17/18页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 3.3V 4A 16MLPQ |
| 标准包装： | 1 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 3.3V |
| 输入电压： | 2.9 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 1.5MHz |
| 电流 - 输出： | 4A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-UFQFN 裸露焊盘 |
| 包装： | 标准包装 |
| 供应商设备封装： | 16-MLPQ-UT（3x3） |
| 其它名称： | SC185QULDKR |
DIM
.020
.024
0.50
A
.000
.002
0.00
0.05
A1
C
e/2
LxN
E/2
PLANE
E1
.020
.024
0.50
0.60
.000
.002
0.00
0.05
OutlineDrawing–3x3MLPQ-UT16
A D
PIN 1
INDICATOR
(LASER MARK)
A
aaa C
A1
D1
B
E
A2
C
PIN 1 E
INDICATOR
(LASER MARK)
A A2 (.006) (0.152) SEATING
e .020 BSC 0.50 BSC
aaa .003 0.08
SEATING bbb .004 0.10
A D B
DIMENSIONS
INCHES MILLIMETERS
MIN NOM MAX MIN NOM MAX
- - A2 0.60
- -
aaa C b .007 .009 .012 0.18 0.23 0.30 PLANE
D .114 .118 .122 2.90 3.00 3.10
D1
A1 .061 .067 .071 1.55 1.70 1.80
D1
E .114 .118 .122 2.90 3.00 3.10
E1 .061 .067 .071 1.55 1.70 1.80
L .012 .016 .020 0.30 0.40 0.50
N 16 16
2
1
DIM
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
SC185
INCHES MILLIMETERS
MIN NOM MAX MIN NOM MAX
- -
- -
(.006) (0.152)
.007 .009 .012 0.18 0.23 0.30
.114 .118 .122 2.90 3.00 3.10
.061 .067 .071 1.55 1.70 1.80
.114 .118 .122 2.90 3.00 3.10
.061 .067 .071 1.55 1.70 1.80
.020 BSC 0.50 BSC
.012 .016 .020 0.30 0.40 0.50
16 16
.003 0.08
.004 0.10
e/2
N
E1
2
1
LxN
E/2
e
bxN
D/2 bbb C A B
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2.
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
N
e
3.
DAP IS 1.90 x 1.90mm.
D/2
bxN
bbb
C A B
Land Pattern – 3x3 MLPQ-UT16
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
3.
H
DAP IS 1.90 x 1.90mm.
(C)
R
K
X
P
G
Y
Z
DIM
C
G
H
K
P
R
X
Y
Z
DIMENSIONS
INCHES MILLIMETERS
(.114) (2.90)
.083 2.10
.067 1.70
.067 1.70
.020 0.50
.006 0.15
.012 0.30
.031 0.80
.146 3.70
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
? 2010 Semtech Corp.
17
www.semtech.com
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