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| 型号： | SC189ZSKTRT |
| 厂商： | Semtech |
| 文件页数： | 21/24页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 3.3V SOT23-5 |
| 标准包装： | 1 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 3.3V |
| 输入电压： | 2.9 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 2.5MHz |
| 电流 - 输出： | 1.5A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-74A，SOT-753 |
| 包装： | 标准包装 |
| 供应商设备封装： | SOT-23-5 |
| 产品目录页面： | 1357 (CN2011-ZH PDF) |
| 其它名称： | SC189ZSKDKR |
SC189
Applications Information (continued)
PCB Layout Considerations
The layout diagram in figure 7 and figure 8 shows a
recommended PCB for MLPD-UT6 2x2 and SOT23-5
package, respectively. Fundamental layout rules must
be followed since the layout is critical for achieving the
performance specified in the Electrical Characteristics
VOUT
L
GND
table. Poor layout can degrade the performance of the DC-
DC converter and can contribute to EMI problems, ground
bounce, and resistive voltage losses. Poor regulation and
instability can result.
The following guidelines are recommended when
developing a PCB layout:
1. The input capacitor, C IN should be placed as close to the
VIN and GND pins as possible. This capacitor provides
a low impedance loop for the pulsed currents present
at the buck converter ’s input. Use short wide traces
to connect as closely to the IC as possible. This will
minimize EMI and input voltage ripple by localizing
the high frequency current pulses.
2. Keep the LX pin traces as short as possible to minimize
pickup of high frequency switching edges to other
parts of the circuit. C OUT and L should be connected as
close as possible between the LX and GND pins, with
a direct return to the GND pin from C OUT .
3. Route the output voltage feedback/sense path away
U1
GND
VIN
EN
(a) Top layer for MLPD-UT6 2x2 package
GND
GND
(b) Bottom layer for MLPD 2x2 package
Figure 7 — Recommended PCB Top & Bottom Layer
Layout for MLPD-UT6 2x2 Package
from inductor and LX node to minimize noise and
magnetic interference.
4. Use a ground plane referenced to the SC189 GND pin.
Use several vias to connect to the component side
ground to further reduce noise and interference on
C IN
L
VOUT
C OUT
sensitive circuit nodes.
5. If possible, minimize the resistance from the VOUT and
VIN
U1
GND
GND pins to the load. This will reduce the voltage drop
on the ground plane and improve the load regulation.
And it will also improve the overall efficiency by
reducing the copper losses on the output and ground
planes.
(a) Top layer for SOT23-5 package
GND
EN
(b) Bottom layer for SOT23-5 package
Figure 8 — Recommended PCB Top & Bottom Layer
Layout for SOT23-5 Package
? 2009 Semtech Corp.
21
www.semtech.com
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| SC18IM700 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Master I2C-bus controller with UART interface |
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| SC18IM700IPW,128 | 功能描述:UART 接口集成电路 UART-MASTER I2C RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
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