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| 型号： | SC18IS600IBS |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 总线控制器 |
| 英文描述： | I2C BUS CONTROLLER, PQCC24 |
| 封装： | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN-24 |
| 文件页数： | 18/30页 |
| 文件大小： | 164K |
| 代理商： | SC18IS600IBS |
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SC18IS600_601_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
25 of 30
NXP Semiconductors
SC18IS600/601
SPI to I2C-bus interface
11. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
11.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
11.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
11.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC18IS600IBS,128 | 功能描述:总线收发器 SPI to I2C Bus Interface 24-Pin RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| SC18IS600IBS,151 | 功能描述:I2C 接口集成电路 SPI to I2C Bus Interface 24-Pin RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| SC18IS600IBS,157 | 功能描述:总线收发器 SPI to I2C Bus Interface 24-Pin RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| SC18IS600IBS151 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| SC18IS600IPW | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:SPI to IC-bus interface |
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