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| 型号： | SC3048B |
| 厂商： | RFM |
| 文件页数： | 2/2页 |
| 文件大小： | 0K |
| 描述： | MOD SAW FREQ CTRL 444MHZ SMC-8 |
| 标准包装： | 200 |
| 系列： | SC |
| 类型： | SO（SAW） |
| 频率： | 444MHz |
| 功能： | 三态（输出启用） |
| 输出： | 正弦波 |
| 电源电压： | 3.3V |
| 频率稳定性： | ±200ppm |
| 工作温度： | 0°C ~ 70°C |
| 电流 - 电源（最大）： | 40mA |
| 安装类型： | 表面贴装 |
| 尺寸/尺寸： | 0.530" L x 0.360" W（13.46mm x 9.14mm） |
| 高度： | 0.081"（2.05mm） |
| 封装/外壳： | 8-SMD |
| 包装： | 带卷 (TR) |
444.0 MHz
Differential Sine-Wave Clock
Electrical Connections
Footprint
Terminal
Number
Connection
1
8
Actual size footprint:
1
2
3
4
5
6
7
8
LID
V CC
Ground
NC or Ground
Q Output
Q Output
Ground
ENABLE
Ground
2
3
4
TOP VIEW
7
6
5
Typical Printed Circuit Board Land Pattern
A typical land pattern for a circuit board is shown below. Grounding of the
metallic center pad is optional.
Typically 0.01" to 0.05" or 0.25 mm to
1.25 mm (8 Places)
Case Design
All pads consist of 30 microinches (min) electroless gold on 50 micro-
inches (min) electroless nickel over base metal. The metallic center pad
was designed for mechanical support. Grounding of this pad is optional.
Lid symbolization, including terminal 1 locator dot, are in contrasting ink.
Symbolization varies by model number. For purposes of illustration, only
terminal 1 dot is shown.
.
Typical Test Circuit
(The optimum value of this dimension is
dependent on the PCB assembly process
employed.)
B
C
D
E
V cc
0.1 μ F
Sine-Wave
Tektronix
N (X8)
F (X8)
4.7 μ H
Signal Generator
CSA 803
Digitizing
A
M
L
G
(X3)
H (X2)
V cc
Clock
Under Test
Q
Q
50 ?
50 ?
*
*
Oscilloscope
Ch 1
Trigger
Ch 2
ENABLE
K
J
50 ?
*Power Splitter, Mini-Circuits ZFSC2-4
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
B
13.46
9.14
13.97
9.66
0.530
0.360
0.550
0.380
Timing Definitions
C
2.05 Nominal
0.081 Nominal
D
E
3.56 Nominal
2.24 Nominal
0.141 Nominal
0.088 Nominal
Propagation Delay:
ENABLE
F
G
H
J
K
L
M
N
1.27 Nominal
2.54 Nominal
3.05 Nominal
1.93 Nominal
5.54 Nominal
4.32 Nominal
4.83 Nominal
0.50 Nominal
0.050 Nominal
0.100 Nominal
0.120 Nominal
0.076 Nominal
0.218 Nominal
0.170 Nominal
0.190 Nominal
0.020 Nominal
50%
Q or Q Output
Amplitude
Envelope
t PD
90%
50%
t PD
10%
Symmetry:
Materials
Q or Q Output
Solder Pad
Au plating 30 - 60 μinches (76.2-152 μm) over 80-
50%
50%
50%
Termination
200 μinches (203-508 μm) Ni.
Lid
Body
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11%
Phosphorus) 100-200 μinches Thick
Al 2 O 3 Ceramic
Symmetry as
% of Period
Period
Symmetry as
% of Period
RF Monolithics, Inc.
RFM Europe
Phone: (972) 233-2903
Phone: 44 1963 251383
Fax: (972) 387-9148
Fax: 44 1963 251510
E-mail: info@rfm.com
http://www.rfm.com
Page 2 of 2
?1999 by RF Monolithics, Inc. The stylized RFM logo are registered trademarks of RF Monolithics, Inc.
SC3048B-022806
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