参数资料
| 型号： | SC553ISKTRT |
| 厂商： | Semtech |
| 文件页数： | 6/7页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .15A SOT-23-5 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.25 V ~ 6 V |
| 输入电压： | 2.25 V ~ 6.5 V |
| 电压 - 压降（标准）： | 0.15V @ 150mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA |
| 电流 - 限制（最小）： | 400mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-74A，SOT-753 |
| 供应商设备封装： | SOT-23-5 |
| 包装： | 标准包装 |
| 产品目录页面： | 1358 (CN2011-ZH PDF) |
| 其它名称： | SC553ISKDKR |
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Applications Information (Cont.)
SC553
Thermal Considerations
The worst-case power dissipation for this part is given
by:
Layout Considerations
While layout for linear devices is generally not as critical
as for a switching application, careful attention to detail
P D ( MAX ) = ( V IN ( MAX ) ? V OUT ( MIN ) ) ? I OUT ( MAX ) + V IN ( MAX ) ? I Q ( MAX )
(1)
will ensure reliable operation.
1) Attaching the part to a larger copper footprint will
( 125 ? 85 ) = 370 ° C / W
( T J ( MAX ) ? T A ( MAX ) )
For all practical purposes, equation (1) can be reduced
to the following expression:
(2)
Looking at a typical application, 3.3V to 2.8V at 150mA:
V IN(MAX) = 3.3 + 5% = 3.465V
V OUT(MIN) = 2.8V - 2% = 2.744V
I OUT = 150mA
T A = 85°C
Inserting these values into equation (2) gives us:
Using this figure, we can calculate the maximum thermal
impedance allowable to maintain T J ≤ 125°C:
θ JA ( MAX ) = =
P D ( MAX ) 0 . 108
enable better heat transfer from the device, especially
on PCBs where there are internal ground and power
planes.
2) Place the input and output capacitors close to the
device for optimal transient response and device
behaviour.
3) While the external resistor divider does not need to be
close to the device, care should be taken to avoid routing
the connections next to any lines carrying large amounts
of noise. The simplest solution is to place these resistors
close to the device and routing the top of R1 to the load
if not adjacent to the part.
4) Connect all ground connections directly to the ground
plane. If there is no ground plane, connect to a common
local ground point before connecting to board ground.
Typical Characteristics
Dropout Voltage vs. Output Voltage
vs. Output Current
With the standard SOT-23-5 Land Pattern shown at the
end of this datasheet, and minimum trace widths, the
thermal impedance junction to ambient for SC553 is
256°C/W. Thus no additional heatsinking is required for
this example.
250
225
200
175
150
125
T A = 25°C
Top to bottom:
I OUT = 150mA
I OUT = 100mA
I OUT = 50mA
The junction temperature can be reduced further (or
higher power dissipation can be allowed) by the use of
larger trace widths and connecting PCB copper to the
GND pin (pin 2), which connects directly to the device
substrate. Adding approximately one square inch of PCB
copper to pin 2 will reduce θ JA to approximately
130°C/W and T J(MAX) for the example above to
approximately 100°C. The use of multi layer boards with
100
75
50
25
0
2.0
2.5
3.0
3.5
4.0
V OUT (V)
4.5
5.0
5.5
6.0
internal ground/power planes will lower the junction
temperature and improve overall output voltage
accuracy.
? 2004 Semtech Corp.
6
www.semtech.com
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