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参数资料
| 型号： | SCA1N5804US |
| 厂商： | SEMICOA CORP |
| 元件分类： | 二极管(射频、小信号、开关、功率) |
| 英文描述： | 1 A, 100 V, SILICON, SIGNAL DIODE |
| 封装： | HERMETIC SEALED, GLASS, SMT, 2 PIN |
| 文件页数： | 2/2页 |
| 文件大小： | 611K |
| 代理商： | SCA1N5804US |
PRELIMINA
RY
MAX RATINGS Working peak
reverse voltage
Average
forward
current
Average
forward
current
Forward current
surge peak
Reverse
recovery
time
Thermal resis-
tance: junction
to lead
Thermal resistance:
junction to end-cap
Thermal
reistance
(θ)
VRWM
IO(L)
IO1
IFSM
trr
RθJL
RθJEC
RθJX
TL=+75°C
L = 0.375
in.
(1) (2).
TA=+55°C
(3) (4).
TA = +25°C
operating at IO1
tp = 8.3ms
at L=0.375 in. (5).
(3).
V
A
A(pk)
ns
°C/W
SCA1N5802
50.0
2.5
1.0
35.0
25.0
36.0
13.0
154.0
SCA1N5804
100.0
2.5
1.0
35.0
25.0
36.0
13.0
154.0
SCA1N5806
150.0
2.5
1.0
35.0
25.0
36.0
13.0
154.0
(1).
TEC = TL at L = 0 or Tend tab for US devices
(2).
Derate at 25mA/°C for TL above +75°C for 2.5A ratings.
(3).
For the 1.0A ratings at 55°C, these IO ratings are for thermally (PC boards or other) mounting methods
where the thermal resistance from mounting point to ambient is still sufficiently controlled where TJ(MAX) does
not exceed 175°C
(4).
Derate at 8.33mA/°C for TA above +55°C for 1.0A ratings.
(5).
US device only
PKG TYPE
Axial Lead
Min
Typ
Max
BD
0.065
TBD
0.850 inches
BL
0.125
TBD
0.250 inches
LD
0.027
TBD
0.032 inches
LL
0.700
TBD
1.300 inches
PKG TYPE
US
Min
Typ
Max
BD
0.091
TBD
0.103 inches
BL
0.168
TBD
0.200 inches
ECT
0.019
TBD
0.028 inches
S
0.003
TBD
inches
PKG TYPE
MELF (TBD)
Min
Typ
Max
TBD
inches
TBD
inches
TBD
inches
TBD
inches
PKG TYPE
Die Square
Min
Typ
Max
Note
A
0.068
TBD
0.072 inches
B
0.057
TBD
0.061 inches
C
0.008
TBD
0.012 inches
Top Metal
38.000
TBD
-
kA
Anode - Al
Back Metal
3.500
TBD
-
kA
Cathode - Au
SCA1N5802
*
SCA1N5804
*
SCA1N5806
PACKAGING SPECIFICATIONS
1N5806 Packaging
Disclaimer: The information and specs on this data sheet is for preliminary use and actual specs may be
changed at any time without notice and final specs will be determined at time of order.
Oct. 2010-RevX-4
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