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参数资料
| 型号： | SCA1N5807 |
| 厂商： | SEMICOA CORP |
| 元件分类： | 整流器 |
| 英文描述： | 3 A, 50 V, SILICON, RECTIFIER DIODE |
| 封装： | HERMETIC SEALED, GLASS PACKAGE-2 |
| 文件页数： | 2/2页 |
| 文件大小： | 609K |
| 代理商： | SCA1N5807 |
PRELIMINA
RY
MAX RATINGS Working peak
reverse voltage
Average
forward
current
Average
forward
current
Forward current
surge peak
Reverse
recovery
time
Thermal resis-
tance: junction
to lead
Thermal resistance:
junction to end-cap
Thermal
reistance
(θ)
VRWM
IO(L)
IO1
IFSM
trr
RθJL
RθJEC
RθJX
TL=+75°C
L = 0.375 in.
(1) (2).
TA=+55°C
(3) (4).
TA = +25°C
operating at IO1
tp = 8.3ms
at L=0.375 in.
(5).
(3).
V
A
A(pk)
ns
°C/W
SCA1N5807
50.0
6.0
3.0
125.0
30.0
22.0
3.5
52.0
SCA1N5809
100.0
6.0
3.0
125.0
30.0
22.0
3.5
52.0
SCA1N5811
150.0
6.0
3.0
125.0
30.0
22.0
3.5
52.0
(1).
TEC = TL at L = 0 or Tend tab for US devices
(2).
Derate at 60mA/°C for TL above +75°C for 6.0A ratings.
(3).
For the 3.0A ratings at 55°C, these IO ratings are for thermally (PC boards or other) mounting methods
where the thermal resistance from mounting point to ambient is still sufficiently controlled where TJ(MAX) does not
exceed 175°C
(4).
Derate at 25mA/°C for TA above +55°C for 3.0A ratings.
(5).
US device only
PACKAGING SPECIFICATIONS
1N5811 Packaging
SCA1N5807
*
SCA1N5809
*
SCA1N5811
PKG TYPE
Axial Lead
Min
Typ
Max
BD
0.115
TBD
0.142
inches
BL
0.130
TBD
0.250
inches
LD
0.036
TBD
0.042
inches
LL
0.900
TBD
1.300
inches
PKG TYPE
US
Min
Typ
Max
BD
0.137
TBD
0.148
inches
BL
0.200
TBD
0.225
inches
ECT
0.019
TBD
0.028
inches
S
0.003
TBD
inches
PKG TYPE
MELF (TBD)
Min
Typ
Max
TBD
inches
TBD
inches
TBD
inches
TBD
inches
PKG TYPE
Die Square
Min
Typ
Max
Note
A
0.068
TBD
0.072
inches
B
0.057
TBD
0.061
inches
C
0.008
TBD
0.012
inches
Top Metal
38.000
TBD
-
kA
Anode - Al
Back Metal
3.500
TBD
-
kA
Cathode - Au
Disclaimer: The information and specs on this data sheet is for preliminary use and actual specs may be
changed at any time without notice and final specs will be determined at time of order.
Oct. 2010-Rev X4
Axial Lead
US
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