参数资料
| 型号： | SCCSP900842R2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/15页 |
| 文件大小： | 0K |
| 描述： | IC POWER MGT 36-WLCSP |
| 标准包装： | 3,000 |
| 应用： | PC，PDA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 36-UFBGA，WLCSP |
| 供应商设备封装： | 36-WLCSP |
| 包装： | 带卷 (TR) |
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Absolute Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Pin / Parameter
Maximum Voltage
PVIN1, PVIN2, VSW1P, VSW2P, VOUTP, VSW1FB, and VSW2FB
AVIN, VOUTPFB, STTS, ISNS
VREGOUT
BGBYP, EN, VIN1P8, and CLK26M
All other pins
Min
-0.3
-0.3
-0.3
-0.3
-0.3
Max
+7.5
+5.5
+3.1
+2.5
+2.5
Unit
V
ESD Voltage, All Pins (1)
Human Body Model
Machine Model
Charge Device Model
-2
-200
-500
+2
+200
+500
kV
V
V
THERMAL RATINGS
Ambient Operating Temperature
Operating Junction Temperature
Storage Temperature
Maximum Power Dissipation (T A = 25 °C), P D (4)
-40
-40
-65
+85
+150
+150
+260
940
°C
°C
°C
°C
mW
THERMAL RESISTANCE
Parameter
Symbol
Value
Unit
Thermal Resistance
Junction to Ambient (Single Layer Board)
Junction to Ambient (Four Layer Board)
Junction to Board
R Θ JA(1)
R Θ JA(4)
R Θ JB
144
69
27
°C/W
°C/W
°C/W
Notes:
1. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω ), the Machine Model
(MM) (CZAP = 200 pF, RZAP = 0 Ω ), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C for Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL).
4. For T J =150 °C, T A =85 °C and R Θ JA =69 °C/W, application with a 4-layer board.
900842
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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