参数资料
| 型号： | SD05C.TCT |
| 厂商： | Semtech |
| 文件页数： | 5/7页 |
| 文件大小： | 0K |
| 描述： | IC TVS BI-DIR 5V 350W SOD-323 |
| 标准包装： | 1 |
| 电压 - 反向隔离（标准值）： | 5V |
| 电压 - 击穿： | 6V |
| 功率（瓦特）： | 350W |
| 电极标记： | 双向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-76，SOD-323 |
| 供应商设备封装： | SOD-323 |
| 包装： | 标准包装 |
| 产品目录页面： | 1356 (CN2011-ZH PDF) |
| 其它名称： | SD05CDKR |
SD05C through SD24C
PROTECTION PRODUCTS
Applications Information
Device Connection Options
The SDxxC TVS diodes are designed to protect one
data, I/O, or power supply line. The device is designed
to replace multi-layer varistors (MLVs) in portable
applications. It is easily implemented on existing 0805
MLV pads and is only slightly larger than 0603 MLV
pads. The device is bidirectional and may be used on
lines where the signal polarity is above and below
ground. The device is symmetrical, so there is no
cathode band.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
Place the TVS near the input terminals or
connectors to restrict transient coupling.
Minimize the path length between the TVS and
PRELIMINARY
Device Schematic and Pin Configuration
Size Comparison to 0805 MLV
the protected line.
The ESD transient return path to ground should
be kept as short as possible.
Place a TVS and decoupling capacitor between
SOD-323
Note: Nominal dimensions in inches
0805 MLV
power and ground of components that may be
vulnerable to electrostatic discharges to the
ground plane.
Minimize all conductive loops including power
and ground loops.
Use multilayer boards when possible.
Minimize interconnecting line lengths
Never run critical signals near board edges.
Fill unused portions of the PCB with ground
plane.
Component Placement Comparison
Matte Tin Lead Finish
0805 MLV on
0805 Solder Pad
SOD-323 on 0805
MLV Pad
SOD-323 on Recommended
(SOD-323) Solder Pad
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
? 2004 Semtech Corp.
5
www.semtech.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SD05CTG | 制造商:SEMTECH 制造商全称:Semtech Corporation 功能描述:Single Line TVS Diode for ESD Protection in Portable Electronics |
| SD05H0B | 功能描述:DIP 开关/ SIP 开关 DIP / Rotary DIP 5 POS SPST 100mA RoHS:否 制造商:Omron Electronics 位置数量:10 开关类型:DIP 执行器:Rotary 端子节距:2.54 mm 触点形式: 端接类型:Solder Pin 电流额定值:100 mA 电压额定值 DC: 工作温度范围: 安装:Through Hole |
| SD05H0BD | 功能描述:DIP 开关/ SIP 开关 DIP / Rotary DIP RoHS:否 制造商:Omron Electronics 位置数量:10 开关类型:DIP 执行器:Rotary 端子节距:2.54 mm 触点形式: 端接类型:Solder Pin 电流额定值:100 mA 电压额定值 DC: 工作温度范围: 安装:Through Hole |
| SD05H0K | 功能描述:DIP 开关/ SIP 开关 ON OFF SPST 5POS LOW PROFILE DIP SW RoHS:否 制造商:Omron Electronics 位置数量:10 开关类型:DIP 执行器:Rotary 端子节距:2.54 mm 触点形式: 端接类型:Solder Pin 电流额定值:100 mA 电压额定值 DC: 工作温度范围: 安装:Through Hole |
| SD05H0SB | 功能描述:DIP 开关/ SIP 开关 ON OFF SPST 0.1A 25VDC Gull Wing RoHS:否 制造商:Omron Electronics 位置数量:10 开关类型:DIP 执行器:Rotary 端子节距:2.54 mm 触点形式: 端接类型:Solder Pin 电流额定值:100 mA 电压额定值 DC: 工作温度范围: 安装:Through Hole |
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