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参数资料
| 型号： | SDB5010 |
| 元件分类： | 桥式整流 |
| 英文描述： | 50 A, 1000 V, SILICON, BRIDGE RECTIFIER DIODE |
| 封装： | PLASTIC, SDB, 4 PIN |
| 文件页数： | 1/2页 |
| 文件大小： | 64K |
| 代理商： | SDB5010 |
FEATURES
Data Sheet No. BSDB-5000-1B
MECHANICAL SPECIFICATION
MECHANICAL DATA
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated pins
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any. Bolt down on heatsink
Maximum mounting torque= 20 in. lb.
Weight: 0.6 Ounces (17 Grams)
E49
MAXIMUM RATINGS& ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
Typical Thermal Resistance, Junction to Case
MinimumInsulation Breakdown Voltage (Circuit to Case)
R
θJC
°C/W
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
IRM
A
@ T = 25 C
A
o
@ T = 125 C
A
o
2
20
2500
1.10
Junction Operating and Storage Temperature Range
T T
J,
STG
°C
-55 to +175
3.0150sdb
SDB PACKAGE SHOWN ACTUAL SIZE
0.125 Nom
0.750
19.0
n/a
0.200 Typ
1.27 Typ
3.175 Nom
5.08 Typ
28.4
28.7
1.12
1.13
10.3
0.405
0.050 Typ
15.9
0.625
MILLIMETERS
INCHES
MIN
MAX
SYM
BL
BW
LD
LL
LM
LO
LS
Average Forward Rectified Current@ T = 55 C
C
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
IO
VRMS
VRRM
VRM
SYMBOL
SDB
RATINGS
UNITS
VOLTS
SDB
50
100
200
400
1000
35
70
140
280
700
50
Peak Forward Surge Current. Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method). T = 175 C
J
O
Forward Voltage (Per Diode) at 20 Amps DC
VOLTS
AMPS
VFM
IFSM
600
0.96
600
800
50
100
200
400
1000
600
800
420
560
5000
5001
5002
5004
5006
5008
5010
Max.
Typ.
0.93
1.00
0.97
UL RECOGNIZED- FILE #E124962
HEAT
SINK
BL
LL
LM
LS LS LS
BW
LO
+
-
AC
0.205 (5.2) Dia Through
Hole for #8 Screw
LD
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
VISO
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
INTEGRALLY MOLDED HEAT SINK PROVIDES VERY
LOW THERMAL RESISTANCE FOR MAXIMUM HEAT
TRANSFER
SPACE SAVING IN-LINE DESIGN FOR PRINTED
CIRCUIT BOARD APPLICATIONS
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical< 2%, Max.< 10% of Die Area)
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