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参数资料
| 型号： | SDWA.01 |
| 厂商： | Taoglas Limited |
| 文件页数： | 14/16页 |
| 文件大小： | 740K |
| 描述： | RF ANTENNA |
| 标准包装： | 1 |
| 天线类型： | 芯片 |
| 频带数目： | 2 |
| 频率： | 2.4GHz ~ 2.5GHz，4.9GHz ~ 5.85GHz |
| VSWR： | 3 |
| 增益： | 3dBi |
| 端子： | 表面贴装型 |
| 安装类型： | 表面贴装 |
| 高度（最大）： | 0.059"（1.5mm） |
| 包装： | * |
| 其它名称： | 931-1159-6 |
SPE-11-8-129/C/NB
Page 14 of 16
7. Recommended Soldering Conditions
1.
Time shown in the above figures is measured from the point when chip surface
reaches temperature.
2.
Temperature difference in high temperature part should be within 110癈.
3.
After soldering, do not force cool, allow the parts to cool gradually.
*General attention to soldering:
?High soldering temperatures and long soldering times can cause leaching of the
termination, decrease in adherence strength, and the change of characteristic may
occur.
?for soldering, please refer to the soldering curves above. However, please
Keep exposure to temperatures exceeding 200癈 to under 50 seconds.
?please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water
soluble, be sure to wash thoroughly to remove any residue from the underside of
components that could affect resistance.
Cleaning:
When using ultrasonic cleaning, the board may resonate if the output power is too high.
Since this vibration can cause cracking or a decrease in the adherence of the termination, we
recommend that you use the conditions below.
Frequency: 40 kHz max.
Output power: 20W/Iiter
Cleaning time: 5minutes max.
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