参数资料
型号: SF-0402S315-2
厂商: Bourns Inc.
文件页数: 2/4页
文件大小: 0K
描述: FUSE 3.15A 24VDC 0402 SLOW
产品培训模块: SinglFuse™ Thin Film Chip Fuses
标准包装: 10,000
系列: SinglFuse™ SF-0402S
保险丝类型: 板安装(不包括管筒式)
额定电流: 3.15A
额定电压 - DC: 24V
响应时间: 慢速
封装/外壳: 0402(1005 公制)
安装类型: 表面贴装
尺寸/尺寸: 0.039" L x 0.020" W x 0.014" H (1.00mm x 0.52mm x 0.35mm)
额定电压时的断路容量: 35A
熔化 I²t: 0.10868
批准: UL
工作温度: -40°C ~ 105°C
包装: 带卷 (TR)
DC 抗冷流: 0.014 欧姆
SinglFuse ? SF-0402S Series Applications
■ Portable memory
■ LCD monitors
■ Disk drives
■ PDAs
■ Digital cameras
■ Cell phones
■ Rechargeable battery packs
■ Battery chargers
■ Set top boxes
■ Industrial controllers
■ DVDs
SF-0402S Series - Slow Blow Surface Mount Fuses
Solder Re?ow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
200
180 °C
PRE-HEATING ZONE
PEAK: 250 +0/-5 °C, 5 seconds
150
100
150 °C
90 ± 30 Seconds
30 ± 10 Seconds
SOLDERING ZONE
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
50
Product Dimensions
1.0 ± 0.1
(.039 ± .004)
HEATING TIME
0.35 ± 0.05
(.014 ± .002)
Recommended Pad Layout
0.381
(.015)
0.52 ± 0.05
(.020 ± .002)
0.25 ± 0.1
(.010 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.558
(.022)
0.2 ± 0.1
0.2 ± 0.1
1.55
(.008 ± .004) (.008 ± .004)
PACKAGING: 10,000 pcs./reel
Thermal Derating Curve
120
110
DIMENSIONS:
MM
(INCHES)
(.061)
Construction & Material Content
OVERCOAT
Sn PLATING
100
90
80
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Operating Temperature..................................................................................-40 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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