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参数资料
| 型号： | SFC05-4-LF-T75-2 |
| 厂商： | PROTEK DEVICES |
| 元件分类： | 参考电压二极管 |
| 英文描述： | FLIP CHIP ARRAY |
| 中文描述： | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
| 封装： | ROHS COMPLIANT, FLIP CHIP-6 |
| 文件页数： | 4/6页 |
| 文件大小： | 89K |
| 代理商： | SFC05-4-LF-T75-2 |
4
05131.R7 3/07
www.protekdevices.com
SFC05-4
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S - Preheat
T
SMAX
T
SMIN
T
L
t 25°C to Peak
30-60 seconds
T
emperature
-
°C
T
P
155°
140°
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50m
±20m
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P for Lead-Free (SnAgCu):
260-270°C
T
P for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
相关PDF资料 |
PDF描述 |
|---|---|
| SFC05-4-T75-1 | FLIP CHIP ARRAY |
| SFC05-4-T75-2 | FLIP CHIP ARRAY |
| SFC05-5-LF-T75-2 | FLIP CHIP ARRAY |
| SFC05-5-T75-1 | FLIP CHIP ARRAY |
| SFC05-5-T75-2 | FLIP CHIP ARRAY |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SFC05-4-T75-1 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-4-T75-2 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-4TM | 制造商:SEMTECH 制造商全称:Semtech Corporation 功能描述:CSP TVS Flip Chip TVS Diode Array |
| SFC05-5 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5.TC | 制造商:Semtech Corporation 功能描述:CHIPCLAMP FLIP CHIP TVS DIODE ARRAY |
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