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参数资料
| 型号： | SFC05-4.WFT |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封装： | FLIP CHIP, MO-211, CSP-6 |
| 文件页数： | 1/8页 |
| 文件大小： | 218K |
| 代理商： | SFC05-4.WFT |
PROTECTION PRODUCTS
1
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-4
ChipClampΤΜ
ΤΜ
Flip Chip TVS Diode Array
Description
Features
Device Dimensions
Schematic & PIN Configuration
Revision 8/11/04
The SFC05-4 is a quad flip chip TVS array. They are
state-of-the-art devices that utilize solid-state silicon-
avalanche technology for superior clamping perfor-
mance and DC electrical characteristics. The SFC
series TVS diodes are designed to protect sensitive
semiconductor components from damage or latch-up
due to electrostatic discharge (ESD) and other voltage
induced transient events.
The SFC05-4 is a 6-bump, 0.5mm pitch flip chip array
with a 3x2 bump grid. It measures 1.5 x 1.0 x
0.65mm. This small outline makes the SFC05-4
especially well suited for portable applications. Flip
chip TVS devices are compatible with current pick and
place equipment and assembly methods.
Each device will protect up to four data or I/O lines.
The flip chip design results in lower inductance, virtu-
ally eliminating voltage overshoot due to leads and
interconnecting bond wires. They may be used to meet
the ESD immunity requirements of IEC 61000-4-2,
Level 4 (±15kV air, ±8kV contact discharge).
Applications
Mechanical Characteristics
Cell Phone Handsets and Accessories
Personal Digital Assistants (PDA’s)
Notebook and Hand Held Computers
Portable Instrumentation
Smart Cards
MP3 Players
GPS
300 Watts peak pulse power (t
p = 8/20s)
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20s)
Small chip scale package requires less board space
Low profile (< 0.65mm)
No need for underfill material
Protects four I/O or data lines
Low clamping voltage
Working voltage: 5V
Solid-state silicon-avalanche technology
JEDEC MO-211, 0.50 mm Pitch Flip Chip Package
Non-conductive top side coating
Marking : Marking Code
Packaging : Tape and Reel
SFC05-4 Maximum Dimensions (mm)
3 x 2 Grid CSP TVS (Bottom View)
相关PDF资料 |
PDF描述 |
|---|---|
| SFC05-4.WMT | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFC05-5-T710-2 | 250 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE |
| SFC05-5.WMT | 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFF1605G | 16 A, 300 V, SILICON, RECTIFIER DIODE, TO-220AB |
| SFF1608G | 16 A, 600 V, SILICON, RECTIFIER DIODE, TO-220AB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SFC05-5 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5.TC | 制造商:Semtech Corporation 功能描述:CHIPCLAMP FLIP CHIP TVS DIODE ARRAY |
| SFC05-5.WCT | 制造商:Semtech Corporation 功能描述:Diode |
| SFC05-5_07 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5_10 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:250w flip chip tvs array |
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