参数资料
型号: SFC05-5.WCT
元件分类: TVS二极管 - 瞬态电压抑制
英文描述: 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB
封装: 1.50 X 1 MM, 0.65 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, MO-211, FLIP CHIP, CSP-6
文件页数: 5/7页
文件大小: 226K
代理商: SFC05-5.WCT
5
2004 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-5
Printed Circuit Board Finish
A uniform board finish is critical for good assembly
yield. Two finishes that provide uniform surface coat-
ings are immersion nickel gold and organic surface
protectant (OSP). A non-uniform finish such as hot air
solder leveling (HASL) can lead to mounting problems
and should be avoided.
Stencil Design
A properly designed stencil is key to achieving ad-
equate solder volume without compromising assembly
yields. A 0.100mm thick, laser cut, electro-polished
stencil with 0.275mm square apertures and rounded
corners is recommended.
Reflow Profile
The flip chip TVS can be assembled using the reflow
requirements for IPC/JEDEC standard J-STD-020 for
assembly of small body components. During reflow,
the component will self-align itself on the pad.
Circuit Board Layout Recommendations for Suppres-
sion of ESD
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Stencil Design
Applications Information (Continued)
Assembly Guideline for Pb-Free Soldering
The following are recommendations for the assembly
of this device:
r
e
t
e
m
a
r
a
P
y
l
b
m
e
s
An
o
i
t
a
d
n
e
m
o
c
e
R
n
o
it
i
s
o
p
m
o
C
ll
a
B
r
e
d
l
o
Su
C
7
.
0
/
g
A
8
.
3
/
n
S
5
.
5
9
n
g
i
s
e
D
li
c
n
e
t
S
r
e
d
l
o
Sn
g
i
s
e
d
b
P
n
S
e
h
t
s
a
e
m
a
S
s
e
n
k
c
i
h
T
li
c
n
e
t
S
r
e
d
l
o
S)
"
4
0
.
0
(
m
0
1
.
0
n
o
it
i
s
o
p
m
o
C
e
t
s
a
P
r
e
d
l
o
S)
9
.
0
-
5
.
0
(
u
C
)
4
-
3
(
g
A
n
S
e
p
y
T
e
t
s
a
P
r
e
d
l
o
Sr
e
ll
a
m
s
r
o
e
r
e
h
p
s
e
z
i
s
4
e
p
y
T
e
li
f
o
r
P
w
o
lf
e
R
r
e
d
l
o
S0
2
0
-
D
T
S
-
J
C
E
D
E
J
r
e
p
n
g
i
s
e
D
d
a
P
r
e
d
l
o
S
B
C
Pn
g
i
s
e
D
b
P
n
S
e
h
t
s
a
e
m
a
S
h
s
i
n
i
F
d
a
P
B
C
Pi
N
u
A
r
o
P
S
O
相关PDF资料
PDF描述
SFC3.3-4.BCT 150 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB
SFC3.3-4.TK 150 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB
SFF2008G 20 A, 600 V, SILICON, RECTIFIER DIODE, TO-220AB
SFPB-62 2 A, 20 V, SILICON, RECTIFIER DIODE
SFPB-72 3 A, 20 V, SILICON, RECTIFIER DIODE
相关代理商/技术参数
参数描述
SFC05C-1.TC 制造商:Semtech Corporation 功能描述: 制造商:Semtech Corporation 功能描述:350 W, BIDIRECTIONAL, SILICON, TVS DIODE
SFC-1 功能描述:I/O 连接器 SFP CAGE 1 PORT RoHS:否 制造商:Hirose Connector 产品:Plugs 系列:DH 端口数量: 位置/触点数量:51 节距:1 mm 触点电镀: 触点材料: 型式:Male 电流额定值:0.5 A 安装风格:Cable 端接类型:IDC 颜色: 安装角:
SFC10 制造商:Omron Corporation 功能描述:
SFC-10 制造商:Marcom Electronic Components 功能描述:FERRITE CORE SPLIT 10.5MM 266OHM 制造商:Marcom Electronic Components 功能描述:FERRITE CORE HINGED 10.5MM 制造商:Marcom Electronic Components 功能描述:FERRITE CORE, SPLIT, 10.5MM, 266OHM/100MHZ; Cable Diameter Max:10.5mm; Ferrite Mounting:Split Core; Frequency Range:-; Impedance:266ohm; Series:SFC ;RoHS Compliant: Yes
SFC1015 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:EMC CHOKE COIL