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参数资料
| 型号： | SFCO5-5.WCT |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封装： | LEAD FREE, MO-211, FLIP CHIP-6 |
| 文件页数： | 1/7页 |
| 文件大小： | 213K |
| 代理商： | SFCO5-5.WCT |
PROTECTION PRODUCTS
1
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-5
ChipClampΤΜ
ΤΜ
Flip Chip TVS Diode Array
Description
Features
Device Dimensions
Schematic & PIN Configuration
Revision 08/02/04
The SFC05-5 is a five line flip chip TVS array. They are
state-of-the-art devices that utilize solid-state silicon-
avalanche technology for superior clamping perfor-
mance and DC electrical characteristics. The SFC
series TVS diodes are designed to protect sensitive
semiconductor components from damage or latch-up
due to electrostatic discharge (ESD) and other voltage
induced transient events.
The SFC05-5 is a 6-bump, 0.5mm pitch flip chip array
with a 3x2 bump grid. It measures 1.5 x 1.0 x
0.65mm. This small outline makes the SFC05-5
especially well suited for portable applications. CSP
TVS devices are compatible with current pick and place
equipment and assembly methods.
Each device will protect up to five data or I/O lines.
The flip chip design results in lower inductance, virtually
eliminating voltage overshoot due to leads and inter-
connecting bond wires. They may be used to meet the
ESD immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge).
Applications
Mechanical Characteristics
Cell Phone Handsets and Accessories
Personal Digital Assistants (PDA’s)
Notebook and Hand Held Computers
Portable Instrumentation
Smart Cards
MP3 Players
GPS
200 Watts peak pulse power (tp = 8/20s)
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 20A (8/20s)
Small chip scale package requires less board space
Low profile (< 0.65mm)
No need for underfill material
Protects five I/O or data lines
Low clamping voltage
Working voltage: 5V
Solid-state silicon-avalanche technology
JEDEC MO-211, 0.50 mm Pitch Flip Chip Package
Non-conductive top side coating
Marking : Marking Code
Packaging : Tape and Reel
SFC05-5 Maximum Dimensions (mm)
3 x 2 Grid CSP TVS (Bottom View)
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