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参数资料
| 型号： | SFH3211-Z |
| 元件分类： | 光敏三极管 |
| 英文描述： | PHOTO TRANSISTOR DETECTOR |
| 封装： | MINIATURE, SMT, 2 PIN |
| 文件页数： | 7/7页 |
| 文件大小： | 73K |
| 代理商： | SFH3211-Z |
SFH 3211, SFH 3211 FA
2002-01-25
7
Zustzliche Informationen über allgemeine Ltbedingungen erhalten Sie auf Anfrage.
For additional information on general soldering conditions please contact us.
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Lthinweise
Soldering Conditions
Bauform
Types
Tauch-, Schwall- und Schleppltung
Dip, Wave and Drag Soldering
Reflowltung
Reflow Soldering
Ltbad-
temperatur
Temperature
of the
Soldering
Bath
Maximal
zulssige
Ltzeit
Max. Perm.
Soldering
Time
Abstand
Ltstelle –
Gehuse
Distance
between
Solder Joint
and Case
Ltzonen-
temperatur
Temperature
of Soldering
Zone
Maximale
Durchlaufzeit
Max. Transit
Time
TOPLED RG
260
°C10 s
–
245
°C
10 s
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