参数资料
型号: SFH620AGB-X019
厂商: VISHAY SEMICONDUCTORS
元件分类: 光电耦合器
英文描述: 1 CHANNEL AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER
封装: ROHS COMPLIANT, SMD, 4 PIN
文件页数: 2/7页
文件大小: 104K
代理商: SFH620AGB-X019
Document Number: 83676
For technical questions, contact: optocoupler.answers@vishay.com
www.vishay.com
Rev. 1.5, 10-Dec-08
669
SFH620AA, SFH620AGB
Optocoupler, AC Input, 5300 VRMS
Vishay Semiconductors
Notes
(1) Tamb = 25 °C, unless otherwise specified.
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
(2) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
Note
Tamb = 25 °C, unless otherwise specified.
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
INPUT
Reverse voltage
VR
6.0
V
DC forward current
IF
± 60
mA
Surge forward current
tp ≤ 1.0 s
IFSM
± 2.5
A
Total power dissipation
Pdiss
100
mW
OUTPUT
Collector emitter voltage
VCE
70
V
Emitter collector voltage
VEC
7V
Collector current
IC
50
mA
tp ≤ 1.0 ms
IC
100
mA
Power dissipation
Pdiss
150
mW
COUPLER
Isolation test voltage
between emitter and detector
VISO
5300
VRMS
Creepage distance
≥ 7mm
Clearance distance
≥ 7mm
Insulation thickness between
emitter and detector
0.4
mm
Comparative tracking index per
DIN IEC 112/VDE 0303 part 1
CTI
175
Isolation resistance
VIO = 500 V, Tamb = 25 °C
RIO
≥ 1012
Ω
VIO = 500 V, Tamb = 100 °C
RIO
≥ 1011
Ω
Storage temperature
Tstg
- 55 to + 150
°C
Ambient temperature
Tamb
- 55 to +100
°C
Junction temperature
Tj
100
°C
Soldering temperature (2)
max. 10 s, dip soldering distance
to seating plane
≥ 1.5 mm
Tsld
260
°C
ELECTRICAL CHARACTERISTICS
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX.
UNIT
INPUT
Forward voltage
IF = ± 60 mA
VF
1.25
1.65
V
Capacitance
VR = 0 V, f = 1 MHz
CO
50
pF
Thermal resistance
Rthja
750
K/W
OUTPUT
Collector emitter capacitance
VCE = 5 V, f = 1 MHz
CCE
6.8
pF
Thermal resistance
Rthja
500
K/W
COUPLER
Collector emitter saturation voltage
IF = 10 mA, IC = 2.5 mA
VCEsat
0.25
0.4
V
Coupling capacitance
CC
0.2
pF
Collector emitter leakage current
VCE = 10 V
SFH620AA
ICEO
10
100
nA
SFH620AGB
ICEO
10
100
nA
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