参数资料
型号: SFH6325-X009
厂商: VISHAY SEMICONDUCTORS
元件分类: 光电耦合器
英文描述: 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 1 Mbps
封装: ROHS COMPLIANT, SMD, 8 PIN
文件页数: 7/14页
文件大小: 292K
代理商: SFH6325-X009
SFH6325, SFH6326
www.vishay.com
Vishay Semiconductors
Rev. 1.7, 06-Jul-11
2
Document Number: 83679
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
Notes
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
(1) Tamb = 0 °C to 70 °C, unless otherwise specified.
(2) To measure crosstalk, turn on the LED for channel 1 and the output current for channel 2 in logic high. Repeat for channel 2.
OUTPUT
Supply voltage
VS
- 0.5 to 30
V
Output voltage
VO
- 0.5 to 25
V
Collector output current
ICO
8mA
Derate linearly from 25 °C
1.33
mW/°C
Power dissipation
Tamb 70 °C
Pdiss
50
mW
COUPLER
Isolation test voltage
t = 1 s
VISO
5300
VRMS
Pollution degree (DIN VDE0109)
Creepage distance
7mm
Clearance distance
7mm
Derate linearly from 25 °C
1.93
mW/°C
Total package dissipation
Ptot
145
mW
Comparative tracking index per DIN
IEC112/VDE0303 part 1, group IIIa per DIN VDE6110
175
Isolation resistance
VIO = 500 V, Tamb = 25 °C
RIO
1012
VIO = 500 V, Tamb = 100 °C
RIO
1011
Storage temperature range
Tstg
- 55 to + 125
°C
Ambient temperature range
Tamb
- 55 to +100
°C
Soldering temperature (1)
max. 10 s, dip soldering distance
to seating plane
1.5 mm
Tsld
260
°C
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX.
UNIT
INPUT (1)
Forward voltage
IF = 16 mA
VF
1.33
1.9
V
Breakdown voltage
IR = 10 μA
VBR
4.5
V
Reverse current
VR = 4.5 V
IR
0.5
10
μA
Capacitance
VR = 0 V, f = 1 MHz
CO
30
pF
Temperature coefficient of forward voltage
IF = 16 mA
V
F/Tamb
- 1.7
mV/°C
OUTPUT
Logic low supply current
IF = 16 mA, VO = open, VCC = 4.5 V
ICCL
100
200
μA
Supply current, logic high
IF = 0 mA, VO = open, VCC = 15 V
ICCH
0.01
4
μA
Logic low output voltage
IF = 16 mA, VCC = 4.5 V, IO = 1.1 mA SFH6325
VOL
0.1
0.5
V
IF = 16 mA, VCC = 4.5 V, IO = 3 mA
SFH6326
VOL
0.1
0.5
V
Logic high output current
IF = 0 mA, VO = VCC = 5.5 V
IOH
3
500
nA
IF = 0 mA, VO = VCC = 15 V
IOH
50
μA
Channel to channel (2) crosstalk
IF = 16 mA, VO = VCC = 5.5 V
IOH-XT
500
nA
COUPLER
Capacitance (input to output)
f = 1 MHz
CIO
0.6
pF
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
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