参数资料
型号: SFH6756T-X001
厂商: VISHAY SEMICONDUCTORS
元件分类: 光电耦合器
英文描述: 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 10 Mbps
封装: ROHS COMPLIANT, SOIC-8
文件页数: 2/9页
文件大小: 138K
代理商: SFH6756T-X001
www.vishay.com
For technical questions, contact: optocoupleranswers@vishay.com
Document Number: 81331
2
Rev. 1.6, 04-Nov-10
SFH6755T, SFH6756T, SFH6757T
Vishay Semiconductors High Speed Optocoupler, 10 MBd,
Dual, SOIC-8 Package
Notes
(1) Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(2) Refer to reflow profile for soldering conditions for surface mounted devices.
Note
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal
Characteristics of Optocouplers application note.
ABSOLUTE MAXIMUM RATINGS (1) (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
INPUT
Average forward current (single channel)
IF
20
mA
Average forward current (per channel for dual channel)
IF
15
mA
Reverse input voltage
VR
5V
Surge current
t = 100 μs
IFSM
200
mA
Output power dissipation (single channel)
Pdiss
35
mW
Output power dissipation (per channel for dual
Pdiss
25
mW
OUTPUT
Supply voltage
1 min maximum
VCC
7V
Output current
IO
50
mA
Output voltage
VO
7V
Output power dissipation (single channel)
Pdiss
85
mW
Output power dissipation (for dual channel)
Pdiss
60
mW
COUPLER
Isolation test voltage
t = 1 s
VISO
4000
VRMS
Storage temperature
Tstg
- 55 to + 150
°C
Operating temperature
Tamb
- 40 to + 100
°C
Lead solder temperature
for 10 s
260
°C
Solder reflow temperature (2)
for 1 min
Tsld
260
°C
RECOMMENDED OPERATING CONDITIONS
PARAMETER
TEST CONDITION
SYMBOL
MIN.
MAX.
UNIT
Operating temperature
Tamb
- 40
100
°C
Supply voltage
VCC
4.5
5.5
V
Input current low level
IFL
0250
μA
Input current high level
IFH
515
mA
Output pull up resistor
RL
330
4K
Ω
Fanout
RL = 1 k
Ω
N5
-
THERMAL CHARACTERISTICS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
LED power dissipation
at 25 °C
Pdiss
100
mW
Output power dissipation
at 25 °C
Pdiss
500
mW
Maximum LED junction temperature
Tjmax
125
°C
Maximum output die junction temperature
Tjmax
125
°C
Thermal resistance, junction emitter to emitter
θEE
412
°C/W
Thermal resistance, junction detector to emitter
θDE
133
°C/W
Thermal resistance, junction emitter to board
θEB
120
°C/W
Thermal resistance, junction detector to board
θDB
77
°C/W
Thermal resistance, junction emitter to case
θEC
110
°C/W
20510
θ
ET
TE1
TD
TC
θ
EE
θ
EB
θ
DB
θ
DE
TB
TC
TE2
θ
DE
θ
EB
θ
ET
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