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参数资料
| 型号： | SFSD1024N1BN1TO-I-DF-151-STD |
| 厂商： | Swissbit NA Inc |
| 文件页数： | 4/23页 |
| 文件大小： | 0K |
| 描述： | FLASH MICRO SD CARD IND S-200 1G |
| 视频文件： | Swissbit Manufacturing Overview |
| RoHS指令信息： | Environment Protection Declaration |
| 标准包装： | 50 |
| 系列： | S-200u |
| 存储容量： | 1GB |
| 存储器类型： | 存储卡 - microSD? |
| 其它名称： | 1052-1036 SFSD1024N1BN2TO-I-ME-151-STD |
Contents
1 FEATURE SUMMARY ..................................................................................................................................................................... 2
2 ORDER INFORMATION .................................................................................................................................................................. 3
2.1 S TANDARD PRODUCT LIST .......................................................................................................................................................... 3
2.2 A CTUAL PRODUCT LIST .............................................................................................................................................................. 3
2.3 O FFERED OPTIONS FOR CUSTOMER PROJECTS ................................................................................................................................. 3
3 PRODUCT SPECIFICATION ............................................................................................................................................................. 5
3.1 S YSTEM P ERFORMANCE ............................................................................................................................................................ 5
3.2 E NVIRONMENTAL S PECIFICATIONS ............................................................................................................................................... 5
3.2.1 Recommended Operating Conditions ................................................................................................................ 5
3.2.2 Recommended Storage Conditions ................................................................................................................... 6
3.2.3 Humidity & ESD .................................................................................................................................................... 6
3.2.4 Durability .............................................................................................................................................................. 6
3.3 P HYSICAL D IMENSIONS ............................................................................................................................................................ 6
3.4 R ELIABILITY .......................................................................................................................................................................... 6
4 CAPACITY SPECIFICATION ............................................................................................................................................................. 6
5 CARD PHYSICAL ............................................................................................................................................................................ 7
5.1 P HYSICAL DESCRIPTION ............................................................................................................................................................ 7
5.2 S OLDER RECOMMENDATIONS ..................................................................................................................................................... 7
6 ELECTRICAL INTERFACE ................................................................................................................................................................ 8
6.1 E LECTRICAL DESCRIPTION .......................................................................................................................................................... 8
6.2 DC CHARACTERISTICS ............................................................................................................................................................... 9
6.3 S IGNAL L OADING ................................................................................................................................................................... 9
6.4 AC CHARACTERISTICS .............................................................................................................................................................10
7 HOST ACCESS SPECIFICATION .......................................................................................................................................................12
7.1 SD AND SPI B US M ODES ........................................................................................................................................................12
7.1.1 SD Bus Mode Protocol ..........................................................................................................................................12
7.1.2 SPI Bus Mode Protocol ........................................................................................................................................13
7.1.3 Mode Selection ....................................................................................................................................................13
7.2 C ARD R EGISTERS ...................................................................................................................................................................14
8 DECLARATION OF CONFORMITY ..................................................................................................................................................17
9 ROHS AND WEEE UPDATE FROM SWISSBIT ................................................................................................................................18
10 PART NUMBER DECODER ..........................................................................................................................................................20
10.1 M ANUFACTURER ..................................................................................................................................................................20
10.2 M EMORY T YPE ....................................................................................................................................................................20
10.3 P RODUCT T YPE ....................................................................................................................................................................20
10.4 C APACITY ...........................................................................................................................................................................20
10.5 P LATFORM .........................................................................................................................................................................20
10.6 G ENERATION ......................................................................................................................................................................20
10.7 M EMORY O RGANIZATION .......................................................................................................................................................20
10.8 T ECHNOLOGY ......................................................................................................................................................................20
10.9 C HANNELS .........................................................................................................................................................................20
10.10 F LASH C ODE .....................................................................................................................................................................20
10.11 T EMP . O PTION ...................................................................................................................................................................21
10.12 DIE C LASSIFICATION ...........................................................................................................................................................21
10.13 PIN M ODE .......................................................................................................................................................................21
10.14 C ONFIGURATION XYZ ..........................................................................................................................................................21
10.15 O PTION ............................................................................................................................................................................21
11 SWISSBIT LABEL SPECIFICATION ................................................................................................................................................22
11.1 F RONT SIDE LASERING ............................................................................................................................................................22
12 REVISION HISTORY .....................................................................................................................................................................23
Swissbit AG
Industriestrasse 4
Swissbit reserves the right to change products or specifications without notice.
Revision: 1.00
CH-9552 Bronschhofen
Switzerland
www.swissbit.com
info@swissbit.com
S-200u_data_sheet_SD-NxBN_Rev102
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SFSD1024N1BN1TO-I-DF-161-STD | 制造商:SWISSBIT NA INC 功能描述:FLASH |
| SFSD-10-28C-F-20.00-DR-NDX | 制造商:Samtec Inc 功能描述:.050 SOCKET DISCRETE CABLE ASSEMBLY - Bulk |
| SFSD-10-28C-G-03.00-S | 制造商:Samtec Inc 功能描述:.050 SOCKET DISCRETE CABLE ASSEMBLY - Bulk |
| SFSD-10-28C-G-06.00-S | 制造商:Samtec Inc 功能描述:.050 SOCKET DISCRETE CABLE ASSEMBLY - Bulk |
| SFSD-10-28C-G-07.00-S | 制造商:Samtec Inc 功能描述:.050 SOCKET DISCRETE CABLE ASSEMBLY - Bulk |
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