参数资料
型号: SG140-05K
厂商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分类: Fixed Positive Single Output Standard Regulator
英文描述: 5 V FIXED POSITIVE REGULATOR, MBFM2
封装: METAL CAN, TO-3, 2 PIN
文件页数: 2/9页
文件大小: 196K
代理商: SG140-05K
SG140A/SG140 SERIES
2/90 Rev 1.4 6/97
LINFINITY Microelectronics Inc.
Copyright
1997
11861 Western Avenue ∞
∞ Garden Grove, CA 92841
2
(714) 898-8121 ∞
∞FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note 1)
Device
Input Voltage
Input Voltage Differential
Output Voltage
Input Voltage
(transient) (Note 3)
(Output shorted to ground)
5V
35V
50V
35V
6V
35V
50V
35V
8V
35V
50V
35V
12V
35V
50V
35V
15V
35V
50V
35V
18V
35V
50V
35V
24V
40V
50V
35V
POSITIVE REGULATOR
Operating Junction Temperature
Hermetic (K, R, IG - Packages) ................................... 150
°C
Storage Temperature Range ............................
Lead Temperature (Soldering, 10 Seconds) ...................
-65
°C to 150°C
300
°C
FIGURE 1.
PEAK OUTPUT CURRENT
VS. INPUT - OUTPUT DIFFERENTIAL
Note 3. Operation at high input voltages is dependent upon load current. When
load current is less than 5mA, output will rise out of regulation as input-
oiutput differential icreases beyond 30V. Note also from Figure 1, that
maximum load current is reduced at high voltages. The 50V input rating
of the SG140A series refers to ability to withstnd high line or transient
conditions without damage. Since the regulator's maximum current
capability is reduced, the output may fall out of regulation at high input
voltages under nominal loading.
Note 1. Values beyond which damage may occur.
-55
°C to 150°C
Operating Junction Temperature Range:
SG140A/140 ..................................................
RECOMMENDED OPERATING CONDITIONS (Note 2)
Note 2. Range over which the device is functional.
CHARACTERISTIC CURVES
THERMAL DATA
K Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............... 35°C/W
R Package:
Thermal Resistance-Junction to Case,
θ
JC .................
5.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
40°C/W
T Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
15°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
IG Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.5°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
42°C/W
L Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
35°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
Note A. Junction Temperature Calculation: T
J = TA + (PD x θJA).
Note B. The above numbers for
θ
JC are maximums for the limiting
thermal resistance of the package in a standard mounting
configuration. The
θ
JA numbers are meant to be guide-
lines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
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