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参数资料
| 型号： | SG1626J |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | MOSFETs |
| 英文描述： | DUAL HIGH SPEED DRIVER |
| 中文描述： | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP14 |
| 封装： | CERAMIC, DIP-14 |
| 文件页数： | 8/8页 |
| 文件大小： | 148K |
| 代理商： | SG1626J |
9/91 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
∞
∞
Garden Grove, CA 92841
(714) 898-8121
∞
FAX: (714) 893-2570
8
SG1626/SG2626/SG3626
CONNECTION DIAGRAMS & ORDERING INFORMATION
(See Notes Below)
14-PIN CERAMIC DIP
J - PACKAGE
Ambient
Temperature Range
SG1626J/883B
SG1626J/DESC
SG1626J
SG2626J
SG3626J
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
Part No.
Package
Note 1. Contact factory for JAN and DESC product availablity.
2. All packages are viewed from the top.
Connection Diagram
2
3
4
5
1
6
7
14
13
10
12
11
9
8
N.C.
N.C.
IN A
N.C.
GROUND
OUT A
OUT B
N.C.
IN B
N.C.
N.C.
N.C.
N.C.
V
CC
8-PIN CERAMIC DIP
Y - PACKAGE
SG1626Y/883B
SG1626Y/DESC
SG1626Y
SG2626Y
SG3626Y
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
SG2626M
SG3626M
8-PIN PLASTIC DIP
M - PACKAGE
8
7
6
5
2
1
3
4
IN A
N.C.
GROUND
IN B
N.C.
OUT A
OUT B
V
CC
16-PIN WIDE BODY
PLASTIC S.O.I.C.
DW - PACKAGE
SG2626DW
SG3626DW
-25
°
C to 85
°
C
0
°
C to 70
°
C
2
3
4
5
6
7
8
1
13
12
11
14
15
10
9
16
8-PIN TO-99 METAL CAN
T - PACKAGE
SG1626T/883B
SG1626T/DESC
SG1626T
SG2626T
SG3626T
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
IN A
OUT A
N.C.
GND
N.C.
V
CC
8
OUT B
IN B
1
2
3
4
5
7
6
SG1626R/883B
SG1626R/DESC
SG1626R
SG2626R
SG3626R
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
5-PIN TO-66 METAL CAN
R - PACKAGE
1
2
3
V
CC
OUT A
IN A
IN B
OUT B
CASE IS GROUND
Note: Case and tab are
internally connected to
substrate ground.
N.C.
IN A
N.C.
N.C.
IN B
N.C.
GROUND
GROUND
GROUND
GROUND
V
CC
OUT B
N.C.
OUT A
V
CC
N.C.
4
5
SG1626L/883B
-55
°
C to 125
°
C
20-PIN CERAMIC (LCC)
LEADLESS CHIP CARRIER
L- PACKAGE
4
5
6
7
8
18
17
16
15
14
9
10 11 12 13
3
2
1
20 19
11. N.C.
12. N.C.
13. OUT B
14. N.C.
15. V
16. N.C.
17. V
18. N.C.
19. OUT A
20. N.C.
(Note 4)
1. N.C.
2. GROUND
3. N.C.
4. IN A
5. N.C.
6. GROUND
7. N.C.
8. IN B
9. N.C.
10. GROUND
相关PDF资料 |
PDF描述 |
|---|---|
| SG1626R | DUAL HIGH SPEED DRIVER |
| SG1626T | DUAL HIGH SPEED DRIVER |
| SG1626Y | DUAL HIGH SPEED DRIVER |
| SG3626 | DUAL HIGH SPEED DRIVER |
| SG2644 | DUAL HIGH SPEED DRIVER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SG1626J/883B | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:DUAL HIGH SPEED DRIVER |
| SG1626J/DESC | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:DUAL HIGH SPEED DRIVER |
| SG1626J-883B | 制造商:Microsemi Corporation 功能描述:HALF BRIDGE DRIVER, INVERTING - Bulk |
| SG1626J-DESC | 制造商:Microsemi Corporation 功能描述:MOSFET DRVR 3A 2-OUT HI/LO SIDE INV 14CDIP - Rail/Tube |
| SG1626L/883B | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:DUAL HIGH SPEED DRIVER |
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