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参数资料
| 型号： | SG1644R |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | MOSFETs |
| 英文描述： | DUAL HIGH SPEED DRIVER |
| 中文描述： | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, MBFM9 |
| 封装： | HERMETIC SEALED, METAL CAN, TO-66, 9 PIN |
| 文件页数： | 2/8页 |
| 文件大小： | 148K |
| 代理商： | SG1644R |
9/91 Rev 1.2 6/97
Copyright
1997
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
∞
Garden Grove, CA 92841
(714) 898-8121
∞
FAX: (714) 893-2570
2
SG1644/SG2644/SG3644
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (V
) ...........................................................
Logic Input Voltage ...............................................................
Source/Sink Output Current (Each Output)
Continuous ...................................................................
Pulse, 500ns ................................................................
22V
7V
±
0.5A
±
3.0A
Operating Junction Temperature
Hermetic (J, T, Y, R-Packages) ....................................
Plastic (M, DW, L-Packages) ......................................
Storage Temperature Range ............................
Lead Temperature (Soldering, 10 Seconds) ..................
150
°
C
150
°
C
-65
°
C to 150
°
C
300
°
C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the
specified terminal.
THERMAL DATA
J Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 30°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 80°C/W
Y Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 50°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 130°C/W
M Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 60°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 95°C/W
DW Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 40°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 95°C/W
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 25°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 130°C/W
R Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 40°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Note A.
Note B. The above numbers for
θ
are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The
θ
numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
V
IN
= 2.4V
V
IN
= 5.5V
V
IN
= 0V
I
IN
= -10mA
I
OUT
= -200mA
I
OUT
= 200mA
V
IN
= 0V (both inputs)
V
IN
= 2.4V (both inputs)
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input High Current
Input Low Current
Input Clamp Voltage
Output High Voltage
(Note 4)
Output Low Voltage
(Note 4)
Supply Current Outputs Low
Supply Current Outputs High
0.7
500
1.0
-4
-1.5
1.0
27
12
V
V
μ
A
mA
mA
V
V
V
mA
mA
2.0
V
CC
-3
18
7.5
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
Supply Voltage (V
) ..................................
Frequency Range ...............................................
Peak Pulse Current ............................................................
Logic Input Voltage .................................................
4.5V to 20V
(Note 3)
DC to 1.5MHz
±
3A
-0.5 to 5.5V
Operating Ambient Temperature Range (T
)
SG1644 .........................................................
SG2644 ...........................................................
SG3644 ...............................................................
Note 2. Range over which the device is functional.
Note 3. AC performance has been optimized for V
CC
= 8V to 20V.
RECOMMENDED OPERATING CONDITIONS
(Note 2)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1644 with -55
°
C
≤
T
≤
125
°
C, SG2644 with -25
°
C
≤
T
≤
85
°
C, SG3644 with 0
°
C
≤
T
≤
70
°
C, and V
CC
= 20V. Low duty cycle pulse testing techniques are used which maintains junction and case
temperatures equal to the ambient temperature.)
Test Conditions
Parameter
Static Characteristics
Units
SG1644/2644/3644
Min.
Typ. Max.
Note 4. V
CC
= 10V to 20V.
相关PDF资料 |
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|---|---|
| SG1644T | DUAL HIGH SPEED DRIVER |
| SG1644Y | DUAL HIGH SPEED DRIVER |
| SG2731 | DC MOTOR PULSE WIDTH MODULATOR |
| SG2731J | DC MOTOR PULSE WIDTH MODULATOR |
| SG3731 | DC MOTOR PULSE WIDTH MODULATOR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SG1644R/883B | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:DUAL HIGH SPEED DRIVER |
| SG1644R-883B | 制造商:Microsemi Corporation 功能描述:HALF BRIDGE DRIVER, NON-INVERTING - Bulk |
| SG1644T | 制造商:Microsemi Corporation 功能描述:SG1644T - Bulk |
| SG1644T/883B | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:DUAL HIGH SPEED DRIVER |
| SG1644T/DESC | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:DUAL HIGH SPEED DRIVER |
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