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参数资料
| 型号： | SG1843L |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | CURRENT MODE PWM CONTROLLER |
| 中文描述： | 1 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, CQCC20 |
| 封装： | HERMETIC SEALED, CERAMIC, LCC-20 |
| 文件页数： | 2/14页 |
| 文件大小： | 224K |
| 代理商： | SG1843L |
C
U R R E N T
-M
O D E
PWM C
O N T R O L L E R
SG1842/SG1843 Series
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 2000
Rev. 1.6 4/00
2
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Notes 1 & 2)
Supply Voltage (I
< 30mA) ...............................................................Self Limiting
Supply Voltage (Low Impedance Source) ........................................................30V
Output Current (Peak) .......................................................................................±1A
Output Current (Continuous) .......................................................................350mA
Output Energy (Capacitive Load).......................................................................5μJ
Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V
Error Amp Output Sink Current .....................................................................10mA
Power Dissipation at T
= 25°C (DIL-8) ............................................................1W
Operating Junction Temperature
Hermetic (J, Y, F, L Packages)................................................................... 150°C
Plastic (N, M, D, DM Packages) ................................................................ 150°C
Storage Temperature Range.......................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds).................................................. 300°C
PACKAGE PIN OUTS
V
REF
V
CC
OUTPUT
GND
COMP
V
FB
I
SENSE
R
T
/C
T
1
8
2
7
3
6
4
5
M & Y PACKAGE
(Top View)
DM PACKAGE
(Top View)
V
REF
V
CC
OUTPUT
GND
COMP
V
FB
I
SENSE
R
T
/C
T
1
8
2
7
3
6
4
5
V
REF
N.C.
V
CC
V
C
OUTPUT
GND
PWR GND
COMP
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T
/C
T
1
14
2
13
3
12
4
11
5
10
6
9
7
8
D PACKAGE
(Top View)
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
J PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
F PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
L PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
95°C/W
65°C/W
165°C/W
120°C/W
130°C/W
80°C/W
80°C/W
145°C/W
35°C/W
120°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL DATA
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
terminal.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
J & N PACKAGE
(Top View)
COMP
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T
/C
T
V
REF
N.C.
V
CC
V
C
OUTPUT
GROUND
POWER GND
F PACKAGE
(Top View)
10.V
REF
9. V
CC
8. V
C
7. OUTPUT
6. GND
1. COMP
2. V
FB
3. I
SENSE
4. R
T
/C
T
5. POWER GND
1
2
3
4
5
10
9
8
7
6
L PACKAGE
(Top View)
3
2
4
5
6
7
8
9
11
10
1. N.C.
2. COMP
3. N.C.
4. N.C.
5. V
FB
6. N.C.
7. I
SENSE
8. N.C.
9. N.C.
10. R
T
/C
T
1
20 19
18
17
16
15
14
12 13
11. N.C.
12. GROUND
13. N.C.
14. N.C.
15. OUTPUT
16. N.C.
17. V
CC
18. N.C.
19. N.C.
20. V
REF
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