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参数资料
| 型号： | SI3480MS8-KIT |
| 厂商： | Silicon Laboratories Inc |
| 文件页数： | 11/14页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL 8PORT SI3480/52/SI3500 |
| 标准包装： | 1 |
| 主要目的： | 电源管理，以太网供电（POE），PSE |
| 嵌入式： | 否 |
| 已用 IC / 零件： | Si3452，Si3480，Si3500 |
| 已供物品： | 板，线缆，CD |
| 相关产品： | SI3480-A01-GM-ND - IC CTLR 4/8-PORT POE 20-QFN 336-1830-5-ND - IC POE CONTROLLER MIDSPAN 40QFN 336-1829-5-ND - IC POE CONTROLLER MIDSPAN 40QFN 336-1831-5-ND - IC POE CONTROLLER MIDSPAN 40QFN 336-1834-5-ND - IC POE CONTROLLER MIDSPAN 40QFN 336-1844-5-ND - IC POE SWITCH PWR OVER LAN 20QFN 336-1833-5-ND - IC POE CONTROLLER MIDSPAN 40QFN 336-1832-5-ND - IC POE CONTROLLER MIDSPAN 40QFN |
Si3480
8. Landing Pattern: 20-Pin QFN
Figure 3 illustrates the landing pattern for the Si3480. Table 8 lists the values for the dimensions shown in the
illustration.
Figure 3. QFN-20 Recommended PCB Land Pattern
Table 8. QFN-20 PCB Land Pattern Dimensions
Dimension
C1
C2
E
Min
3.70
3.70
0.50
Max
Dimension
X2
Y1
Y2
Min
2.15
0.90
2.15
Max
2.25
1.00
2.25
X1
0.20
0.30
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
mask and the metal pad is to be 60 ? m minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95mm openings on a 1.1 mm pitch should be used for the center pad to
assure the proper paste volume (71% Paste Coverage).
Card Assembly
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
Body Components.
Rev. 1.0
11
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| SI5023-EVB | BOARD EVALUATION FOR SI5023 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SI3481DV | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:P-Channel 30-V (D-S) MOSFET |
| SI3481DV_06 | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:P-Channel 30-V (D-S) MOSFET |
| SI3481DV-T1-E3 | 功能描述:MOSFET 30V 5.3A 0.048Ohm RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| SI3481DV-T1-GE3 | 功能描述:MOSFET 30V 5.3A 2.0W 48mohm @ 10V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| Si3482-A01-GM | 功能描述:热插拔功率分布 12/24/48-prt Pw Mngr Si3452/3PSE Prt Ctrl RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
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