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参数资料
| 型号： | SI8506-C-IM |
| 厂商： | Silicon Laboratories Inc |
| 文件页数： | 13/36页 |
| 文件大小： | 0K |
| 描述： | SENSOR CURR 20A 5.5V UNI 12QFN |
| 标准包装： | 74 |
| 电流 - 感应： | 20A |
| 精确度： | ±5% |
| 电流 - 电源： | 4mA |
| 传感器类型： | 闭环 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 输出： | 可配置 |
| 频率： | 50kHz ~ 1MHz |
| 电极标记： | 单向 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 12-VFQFN |
| 包装： | 管件 |
| 其它名称： | 336-1546-5 |
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Si85xx
3. Application Information
Ground
Ground
3.1. Board Layout
Plane Edge
Top View
Plane Edge
The Si85xx is connected in the series path of the current
to be measured. The Si85xx must be located as far as
possible from transformer and other magnetic field
sources. Like other analog components, the Si85xx
should be powered from a low-noise dc source and,
preferably, to a low-noise analog ground plane.
Recommended bypass capacitors are 1 μF in parallel
with a 0.1 μF, positioned as close to the Si85xx as
VDD Pin
Mode Pin
(Non-Ping-Pong)
VDD Fly Wire
Current
Carrying Slug
possible. When using the Si850x (single output
versions), all three ground pins MUST be connected to
the same ground point, and both VDD1 and VDD2 pins
MUST be tied to the VDD system power supply.
3.2. Layout Requirements
The Si85xx requires special layout techniques to ensure
proper operation (see Figures 9 and 10). Due to the
close proximity of the current-carrying slug and current
sensor silicon, magnetic coupling between the current-
carrying slug and the silicon can form a ground loop
causing the output voltage to be 0 V even though
current is flowing through the slug. To eliminate any
Bonding Wire
Gnd Pin
Bypass Capacitor
5 V VDD Trace
3.5 mm
SOIC Package
Current
Sensor Die
such coupling issues, a red fly-wire VDD trace (see
Figures 9 and 10) should be implemented in the layout.
For the SOIC package, the red fly-wire trace should be
Figure 9. SOIC Layout Requirements
approximately 3.5 mm from the center edge of the
package intersecting approximately in the center of the
package (see Figure 9). For the QFN package, the red
fly-wire should be approximately in the center of the
package (see Figure 10). Standard wire thicknesses for
10 mA current-carrying capabilities should be used.
Moreover, note that the fly-wire trace should be
completely under the ground plane since this will also
Ground Plane Edge
VDD Pin
Mode Pin
(Non-Ping-Pong)
Top View
Ground
Plane Edge
Current
Carrying Slug
reduce coupling.
Regarding isolation voltage requirements, the trace
Bonding
Wires
2 mm
Current
Sensor Die
does not need to follow the lead frame and bonding
traces exactly, as long as the net magnetic flux is close
to zero. The goal here is to keep the magnetic coupling
small and, at the same time, keep the isolation distance
large. Moreover, to ensure that the layout meets the
VDD
Fly Wire
design’s required creepage and clearance
Bypass Capacitor
Gnd Pin
QFN Package
requirements, the VDD trace should be placed on one
of the inner layers or even the back side of the board.
For example, one can lay out the return VDD trace on
the other side of the PCB so the PCB itself can help to
provide high isolation voltage.
5V VDD Trace
Figure 10. QFN Layout Requirements
Preliminary Rev. 0.4
13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SI8506-C-IMR | 制造商:Silicon Laboratories Inc 功能描述:20A CURRENT SENSOR, SINGLE OUTPUT - Tape and Reel |
| SI850X | 制造商:SILABS 制造商全称:SILABS 功能描述:UNIDIRECTIONAL AC CURRENT SENSORS |
| SI85-100 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SMT Power Inductor |
| SI85-100K | 制造商:DELTA 制造商全称:Delta Electronics, Inc. 功能描述:SMT Power Inductor |
| SI85-101 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SMT Power Inductor |
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