参数资料
型号: SKY65116-21
厂商: Skyworks Solutions Inc
文件页数: 10/14页
文件大小: 0K
描述: IC AMP LINEAR 390-500MHZ 12-MCM
产品目录绘图: QFN-12
标准包装: 1
频率: 390MHz ~ 500MHz
P1dB: 32.5dBm(1.778W)
增益: 35dB
噪音数据: 6dB
RF 型: GSM,NMT,TETRA,UHF,WLL
电源电压: 4.5V
电流 - 电源: 1.3A
封装/外壳: 12-LQFN 裸露焊盘
包装: 标准包装
产品目录页面: 586 (CN2011-ZH PDF)
其它名称: 863-1072-6
Data Sheet ? SKY65116
Application Circuit
Reference
Voltage
C3
10 μ F
C6
0.01 μ F
C5
0.01 μ F
C2
10 μ F
PA Control
Voltage
V CC
1
GND
12
11
10
C4
0.01 μ F
9
GND
C1
10 μ F
RF in
50 ? transmission
line
2
3
RFIN
GND
RFOUT
GND
8
7
50 ? transmission
line
RF out
V CC
4
5
6
Pin Assignments
C7
10 μ F
C8
0.01 μ F
Evaluation Board Description
Pin #
1
2
Name
GND
RFIN
GROUND
RF INPUT
Description
THE SKYWORKS SKY65116 EVALUATION BOARD IS USED TO TEST THE
PERFORMANCE OF THE SKY65116 POWER AMPLIFIER MODULE. THE
FOLLOWING DESIGN CONSIDERATIONS ARE GENERAL IN NATURE AND
MUST BE FOLLOWED REGARDLESS OF FINAL USE OR CONFIGURATION.
3
4
5
6
7
8
9
10
GND
V CC1
GND
GND
GND
RFOUT
GND
V CC2
GROUND
STAGE 1 COLLECTOR VOLTAGE
GROUND
GROUND
GROUND
RF OUTPUT
GROUND
STAGE 2 COLLECTOR VOLTAGE
1. PATHS TO GROUND SHOULD BE MADE AS SHORT AS POSSIBLE.
2. THE GROUND PAD OF THE SKY65116 POWER AMPLIFIER MODULE HAS
SPECIAL ELECTRICAL AND THERMAL GROUNDING REQUIREMENTS. THIS PAD
IS THE MAIN THERMAL CONDUIT FOR HEAT DISSIPATION. SINCE THE CIRCUIT
BOARD ACTS AS THE HEAT SINK, IT MUST SHUNT AS MUCH HEAT AS POS-
SIBLE FROM THE AMPLIFIERS. AS SUCH, DESIGN THE CONNECTION TO THE
GROUND PAD TO DISSIPATE THE MAXIMUM WATTAGE PRODUCED TO THE
CIRCUIT. MULTIPLE VIAS TO THE GROUNDING LAYER ARE REQUIRED.
3. TWO EXTERNAL OUTPUT BYPASS CAPACITORS (0.01 μF AND 10 μF) ARE
11 V CNT PA ON/OFF COLTROL VOLTAGE
12 V REF BIAS REFERENCE VOLTAGE
CENTER ATTACHMENT PAD MUST HAVE A LOW INDUCTANCE AND LOW THERMAL RESISTANCE CONNECTION TO
THE CUSTOMER’S PRINTED CIRCUIT BOARD GROUND PLANE.
REQUIRED ON THE V CC1 (PIN 4) SUPPLY INPUT. THE SAME TWO CAPAC-
ITOR VALUES ARE ALSO REQUIRED ON THE V CC2 (PIN 10) SUPPLY INPUT
AND ON THE V REF INPUT (PIN 12). EACH OF THESE CAPACITORS SHOULD
BE PLACED IN PARALLEL BETWEEN THE SUPPLY LINE AND GROUND.
4. V CC1 (PIN 4) AND V CC2 (PIN 10) MAY BE CONNECTED TOGETHER AT
THE SUPPLY.
NOTE: Junction temperature (T J ) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
SKYWORKS SOLUTIONS, INC. ? PHONE [781] 376-3000 ? FAX [781] 376-3100 ? SALES@SKYWORKSINC.COM ? WWW.SKYWORKSINC.COM
10
FEBRUARY 18, 2009 ? SKYWORKS PROPRIETARY INFORMATION ? PRODUCTS AND PRODUCT INFORMATION ARE SUBJECT TO CHANGE WITHOUT NOTICE. ? 200510 REV. H
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