DATA SHEET ? SKY65137-11 WLAN PA
Evaluation Board Description
The SKY65137 - 11 Evaluation Board is used to test the
performance of the SKY65137 - 11 WLAN PA. An assembly drawing
for the Evaluation Board is shown in Figure 20 and the layer detail
is provided in Figure 21 . Layer detail physical characteristics are
noted in Figure 22. A schematic diagram of the SKY65137 - 11
Evaluation Board is shown in Figure 2 3 .
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65137 - 11 has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device. Therefore, design the connection to the ground pad to
dissipate the maximum wattage produced by the circuit board.
Multiple vias to the grounding layer are required .
3. Bypass capacitors should be used on the DC supply lines. The
V CC lines may be connected after the RF bypass and
decoupling capacitors to provide better isolation between each
V CC line. Refer to Figure 23 for further details.
4. The RF lines should be well separated from each other with
solid ground in between traces to maximize input -to- output
isolation.
NOTE: A poor connection between the slug and ground increases
junction temperature (T J ), which reduces the lifetime of the
device. Refer to the Skyworks Application Note, “PCB
Design Guidelines for High Power Dissipation Packages”
(document number 201211) for further information.
Evaluation Board Test Procedure
Step 1: Connect a +5 V supply to the VCC1, VCC2, VCC3, and
VC_BIAS pins. Connect the PA_ENB pin to a separate
supply. If available, enable the current limiting function of
the power supply to 1000 mA.
Step 2: If desired, connect a voltage meter to the V_DET pin.
Step 3: Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of
– 15 dBm or less to the Evaluation Board. DO NOT enable
the RF signal.
Step 4: Connect a spectrum analyzer or vector signal analyzer to
the RF signal output port. Add attenuation as needed to
protect the analyzer.
Step 5: On startup, turn on the VCC1, VCC2, VCC3, and VC_BIAS
lines first. Then turn on the PA_ENB line. Finally, turn on
the RF input. Make sure to keep the initial input power to
the PA at – 20 dBm and gradually increase to the desired
output power level.
Step 6: Take measurements.
Step 7: On power down, turn off the RF input first. Then turn off
the PA_ENB line. Finally, turn off the VCC1, VCC2, VCC3,
and VC_BIAS lines.
Package Dimensions
The PCB layout footprint for the SKY65137 - 11 is provided in
Figure 22 . Package dimensions for the 20 - pin MCM are shown in
Figure 2 3, and tape and reel dimensions are provided in
Figure 24.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65137 - 11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 ° C. It can be used for lead or lead - free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages , document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. ? Phone [781] 376 - 3000 ? Fax [781] 376 - 3100 ? sales@skyworksinc.com ? www.skyworksinc.com
200851J ? Skyworks Proprietary I nformation ? Products and Product Information are Subject to Change Without Notice ? March 25 , 2011
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