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| 型号： | SKY73070-11 |
| 厂商： | Skyworks Solutions Inc |
| 文件页数： | 7/13页 |
| 文件大小： | 0K |
| 描述： | IC MIXER DWNCONVRSN SGL 20-MCM |
| 产品目录绘图： | 20-MCM |
| 标准包装： | 1 |
| RF 型： | CDMA，EDGE，GSM，UMTS，WCDMA |
| 频率： | 700MHz ~ 1GHz |
| 混频器数目： | 1 |
| 增益： | 9.5dB |
| 噪音数据： | 8.3dB |
| 次要属性： | 降频变频器 |
| 电流 - 电源： | 210mA |
| 电源电压： | 4.75 V ~ 5.25 V |
| 包装： | 标准包装 |
| 封装/外壳： | 20-TQFN 裸露焊盘 |
| 供应商设备封装： | 20-MCM（5x5） |
| 产品目录页面： | 587 (CN2011-ZH PDF) |
| 其它名称： | 863-1085-6 |
DATA SHEET ? SKY73070 DOWNCONVERSION MIXER
–55
55
–59
–63
–67
–71
–75
–79
–83
–87
–91
–95
–40 o C
+25 o C
+85 o C
53
51
49
47
45
43
41
39
37
35
–40 o C
+25 o C
+85 o C
824
839
854
869
884
899
914
824
839
854
869
884
899
914
–25
RF Frequency (MHz)
Figure 15. 2RF – 2LO vs Frequency and Temperature
RF Frequency (MHz)
Figure 16. RF to IF Isolation vs Frequency and Temperature
–30
–27
–29
–31
–33
–35
–37
–39
–41
–43
–45
–40 o C
+25 o C
+85 o C
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–40 o C
+25 o C
+85 o C
824
839
854
869
884
899
914
824
839
854
869
884
899
914
RF Frequency (MHz)
Figure 17. LO to IF Leakage vs Frequency and Temperature
Evaluation Board Description
The SKY73070 Evaluation Board is used to test the performance
of the SKY73070 downconversion mixer. An assembly drawing for
the Evaluation Board is shown in Figure 19 and the layer detail is
provided in Figure 20.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short and as low
impedance as possible.
2. The ground pad of the SKY73070 provides critical electrical
and thermal functionality. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as
the heat sink, it must shunt as much heat as possible from
the device. Therefore, design the connection to the ground
RF Frequency (MHz)
Figure 18. LO to RF Leakage vs Frequency and Temperature
to the Package and Handling Information section of this Data
Sheet.
3. Skyworks recommends including external bypass capacitors
on the VCC voltage inputs of the device.
4. Components L5 and L4 (see Figure 21) are high-Q, low loss
inductors. These inductors must be able to pass currents in
excess of 200 mA DC.
5. Components R7 and R8 (see Figure 21) allow for external
adjustment of the IF amplifier bias points. To reduce the IF
amplifier bias current, connect pin 20 to ground through
external resistor R8. To increase the IF amplifier bias current,
connect pin 20 to VCC through external resistor R7. For
operation as specified in Tables 3 and 4, these resistors are
not required.
A schematic diagram for the SKY73070 Evaluation Board is
shown in Figure 21.
pad to dissipate the maximum heat produced by the circuit
board. For more information on soldering the SKY73070, refer
Skyworks Solutions, Inc. ? Phone [781] 376-3000 ? Fax [781] 376-3100 ? sales@skyworksinc.com ? www.skyworksinc.com
200716F ? Skyworks Proprietary and Confidential information ? Products and Product Information are Subject to Change Without Notice ? January 21, 2008
7
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