参数资料
型号: SL1021B500R
厂商: Littelfuse Inc
文件页数: 3/5页
文件大小: 0K
描述: GAS DISCHARGE TUBE 500V 3 TERM
标准包装: 500
系列: SL1021B
电压 - DC 击穿(标称值): 500V
脉冲放电电流 (8/20us): 10kA
极数: 3
故障短路:
安装类型: 通孔
封装/外壳: 轴向圆柱形,3引线(径向弯曲)
包装: 托盘
电流 - AC 放电(标称值): 10A
其它名称: Q1201492
Gas Discharge Tube (GDT) Products
SL1021A/B, SL1024A/B and PMT8 Series
Time vs. Current for Failsafe
60
SL102xA with Failsafe
Voltage vs. Time Characteristic
Max dynamic breakover
voltage
30
20
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SL102xB or PMT8 500 Volt Higher Melting Point Solder
SL102xB or PMT8 350 Volt Higher Melting Point Solder
SL102xB or PMT8 90 Volt Higher Melting Point Solder
Hold-over voltage
On-State voltage
0.5 1
2
5
10
15
30
0
200
400
600
Time (ns)
800
1000
1200
Soldering Parameters - Re?ow Soldering (Surface Mount Devices)
- Temperature Max (T s(max) )
Re?ow Condition
- Temperature Min (T s(min) )
Pre Heat
- Time (Min to Max) (t s )
Average ramp up rate (Liquidus Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
5°C/second max
T P
T L
T S(max)
T S(min)
Preheat
t S
Ramp-up
t P
t L
Critical Zone
T L to T P
Ramp-down
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
(t 25oC to peak)
Time
Peak Temperature (T P )
260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
Do not exceed
10 – 30 seconds
6°C/second max
8 minutes Max.
260°C
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
Recommended Process Parameters:
260
2 4 0
220
200
180
160
1 4 0
120
100
80
60
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100 ° C
150 ° C
60-180 seconds
280 ° C Maximum
2-5 seconds
4 0
20
0
Note: Surge Arrestors with a Failsafe mechanism should be
T ime (Seconds)
Preheat T ime
Dwell T ime
Cooling T ime
individually examined after soldering
?2009 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their speci?c applications.
21
Revised: November 10, 2009
SL1021A/B, SL1024A/B and PMT8 Series
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