参数资料
型号: SL1122A200R
厂商: Littelfuse Inc
文件页数: 3/3页
文件大小: 0K
描述: GAS TUBE 200V HYBRD 5KA 3PINRADL
标准包装: 1,000
系列: SL1122A
电压 - DC 击穿(标称值): 200V
脉冲放电电流 (8/20us): 10kA
安装类型: 通孔
封装/外壳: 径向圆柱形,3引线
包装: 托盘
Gas Discharge Tube (GDT) Products
SL1122A Series
Soldering Parameters - Re?ow Soldering
Re?ow Condition
- Temperature Min (T s(min) )
Pre Heat - Temperature Max (T s(max) )
- Time (Min to Max) (t s )
Average Ramp-up Rate (Liquidus Temp
(T L ) to peak)
T S(max) to T L - Ramp-up Rate
Pb-free assembly
150°C
200°C
60 – 180 seconds
3°C/second max.
5°C/second max.
T P
T L
T S(max)
T S(min)
Preheat
t S
Ramp-up
t P
t L
Critical Zone
T L to T P
Ramp-down
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
(t 25oC to peak)
Time
Peak Temperature (T P )
260 +0/-5 °C
Time within 5°C of Actual Peak
Temperature (t p )
Ramp-down Rate
Time 25°C to Peak Temperature (T P )
Do not exceed
10 – 30 seconds
6°C/second max.
8 minutes max.
260°C
* Devices that are soldered require inspection before use.
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
Recommended Process Parameters:
260
2 4 0
220
200
180
160
1 4 0
120
100
80
60
4 0
20
0
T ime (Seconds)
Preheat T ime
Cooling T ime
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100 ° C
150 ° C
60-180 seconds
280 ° C Maximum
2-5 seconds
Dwell T ime
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
?2009 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their speci?c applications.
47
Revised: November 10, 2009
SL1122A Series
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