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参数资料
| 型号： | SL1ICS3001 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | I.CODE1 Label IC Chip Specification |
| 中文描述： | I.CODE1标签IC芯片规格 |
| 文件页数： | 13/22页 |
| 文件大小： | 376K |
| 代理商： | SL1ICS3001 |
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 13 of 22
10 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips
‘General Specification for 6” Wafer (Prod. Spec.)’.
10.1 Storage Recommendations
Unsawn/sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
Climate atmosphere:
Duration of storage:
15 ... 25 °C
40 ... 60 % r.h. or dried N
2
(only unsawn wafers!)
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
10.2 Possible Forms of Delivery
10.2.1 Packing of Unsawn Wafers
Delivery form:
wafer box
10.2.2 Packing of Sawn Wafers
Delivery form:
Foil thickness:
Foil material:
Film Frame Carrier (standard Philips carrier type P7)
0.55 ... 0.85 mm
sticky foil
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SL1ICS3001U | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/L6D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/N5D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W/N4D | 功能描述:射频无线杂项 ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作频率:112 kHz to 205 kHz 电源电压-最大:3.6 V 电源电压-最小:3 V 电源电流:8 mA 最大功率耗散: 工作温度范围:- 40 C to + 110 C 封装 / 箱体:VQFN-48 封装:Reel |
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