ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 2 of 22
1 Contents
1
CONTENTS
2
2
DEFINITIONS
2.1
Life Support Applications ....................................................................................................4
2.2
Abbreviations ........................................................................................................................4
4
3
SCOPE
5
4
ORDERING INFORMATION
5
5
FUNCTIONAL DESCRIPTION
5.1
Basic Features.......................................................................................................................6
5.2
Block Diagram of the IC.......................................................................................................6
5.3
Memory Organisation...........................................................................................................7
5.3.1
Serial Number...................................................................................................................7
5.3.2
Write Access Conditions..................................................................................................7
5.3.3
Special Functions (EAS/QUIET).....................................................................................8
5.3.4
Family Code and Application Identifier...........................................................................8
5.3.5
Configuration of delivered ICs.........................................................................................8
6
6
MECHANICAL DIE SPECIFICATIONS
9
7
MECHANICAL WAFER SPECIFICATIONS
7.1
Wafer Status ........................................................................................................................10
7.2
Backside Treatment ............................................................................................................10
10
8
DOCUMENTATION
11
8.1
8.2
Delivery Documentation.....................................................................................................11
Fail-Die Identification.........................................................................................................11
8.2.1
Ink Dot Specification......................................................................................................11
8.2.2
Wafer Mapping...............................................................................................................11
9
QUALITY ASSURANCE
12
9.1
9.2
Electrical Acceptance Test.................................................................................................12
Visual Inspection.................................................................................................................12
9.2.1
After Wafer Final Test....................................................................................................12
9.2.2
After Sawing (Film Frame Carrier)................................................................................12
10
PACKING
13
10.1 Storage Recommendations.................................................................................................13
10.2 Possible Forms of Delivery.................................................................................................13
10.2.1 Packing of Unsawn Wafers............................................................................................13
10.2.2 Packing of Sawn Wafers................................................................................................13