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参数资料
| 型号： | SLP-3118B-51-T1 |
| 元件分类： | LED |
| 英文描述： | T-1 SINGLE COLOR LED, YELLOW GREEN, 3.1 mm |
| 文件页数： | 5/6页 |
| 文件大小： | 47K |
| 代理商： | SLP-3118B-51-T1 |
SLP-3118B-51-T1
No.6224 5/6
< Automatic stick inserting, straight taping type >
(1) Bending a lead should avoid not to cause chip deterioration or so. When bending is necessary, care must be taken
considering the following points :
q Bending a lead must be done before soldering.
w A lead must be bent at intervals of 1.6mm from the edge of the regin part.
e Do not bend the same portion of lead more than twice.
(2) Setting a product by a tool such as holder should avoid. When necessary, no stress should be applied to the regin part and
lead by sufficient considerations on dimension tolerance, thermal expansion, thermal contraction of holder, product and
circuit board.
(3) The hole pitch of a circuit board must fit to its lead pitch.
(4) When soldering, care must be taken considering the following points :
q Do not heat a product under any stress (ex. : twist) to leads.
w Do not heat (by soldering, for example) a product in the states of being forced to the resin part.
(5) Do not use the flux containing chlorine (max. 0.2wt%) which may cause corrosion of lead and washing is preferable.
When washing is necessary, avoid washing the whole product and wash only the needed part under the following
conditions.
Chemicals : Methyl alchole.
Temperature : 45
°C max.
Time : 30sec. max.
Note :Recommendatory conditions of automatic insertion and reflow (adhesive hardening process) taping lamp is
automatically inserted and the chip portion is attached to the back side. When using taping lamp in the process
through reflow furnace, follow the initial conditions in the new process to prevent gold wire breaking in process
of LED manufacturing and to secure high reliability.
(1)Setting of automatic insertion machine
q Speed : not more than 1.0sec. / p.
w Chuch pressure : not more than 3.0kg / cm2.
e Head pressure : not more than 1.0kg / cm2.
r Clinch angle : bendingangle.
--Anode side within 15
°
--Cathode side within 45
°
t Cutter : To avoid tearing lead off, use of sharp and hard cutter withstanding 1million time in preferable.
(2)Pre-hardening furnace
q Temperature : When hardening chips by adhesive at 150
°C(120sec), set the surface temperature of LED regin part to
120
°C or less ; even influence of increase in temperature to the back side of LED part is low.
(Temperature of 130
°C is about the line that causes deformation (heat deflection temperature) of regin used in
standard LED. If temperature is increased while stress is on lead, even small, resin is softened and the life of held
lead is lowered. This may cause gold wire breaking due to moving lead.)
(3)Solder dipping
q Temperature of soldering bath : 260
°C or less.
w Dipping time : within 5sec.
e Lead soldering condition : min 1.6mm from case.
PRECAUTIONS
<Cl inch angle>
45
° min.
Cathode
15
° min.
Anode
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