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参数资料
| 型号： | SM05T3G |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 300 W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236AB |
| 封装： | LEAD FREE, PLASTIC, CASE 318-08, TO-236, 3 PIN |
| 文件页数： | 5/6页 |
| 文件大小： | 60K |
| 代理商： | SM05T3G |
SM05T1 Series
http://onsemi.com
5
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AL
b
C
L
D
A
E
A1
e
3
1
2
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
0.89
1.00
1.11
0.035
INCHES
A1
0.01
0.06
0.10
0.001
b
0.37
0.44
0.50
0.015
c
0.09
0.13
0.18
0.003
D
2.80
2.90
3.04
0.110
E
1.20
1.30
1.40
0.047
e
1.78
1.90
2.04
0.070
L
0.35
0.54
0.69
0.014
2.10
2.40
2.64
0.083
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 31801 THRU 07 AND 09 OBSOLETE, NEW
STANDARD 31808.
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
HE
0.040
0.044
0.002
0.004
0.018
0.020
0.005
0.007
0.114
0.120
0.051
0.055
0.075
0.081
0.021
0.029
0.094
0.104
NOM
MAX
H E
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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